IP Library Granted Patent US 8,377,368
Granted Patent B2
US 8,377,368 · App. 12/964,178 · Granted Feb 19, 2013

Component mounting arrangement

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Quick Facts
Patent No.
US 8,377,368
App. No.
12/964,178
Granted
Feb 19, 2013
Kind
B2
Abstract

A method of connecting a component to a molded article may include disposing a component adjacent to a wall of the article being molded, overlapping a portion of the component with a portion of the wall of the article being molded while the wall is still at least partially molten, and permitting the wall of the article being molded to cool with said portion of the component still overlapped by the wall. Preferably, a portion of the component is overlapped on two sides by the wall of the article being molded to firmly retain the component relative to the article after the article is formed. The article may be a receptacle, or any other object, as desired.

Claims (14)

1. A method of forming a molded article with a component attached to the article, comprising:

providing a molten parison into a mold cavity defined by at least two molds;

forming the parison into the mold cavity;

severing at least a portion of the parison;

separating at least two of the molds to also separate portions of the severed parison and expose an interior of the parison;

disposing a component adjacent to a wall of the parison;

overlapping a portion of the component with a portion of the wall of the parison while the wall is still at least partially molten, so that at least a portion of the component is trapped between two portions of the parison wall to permanently couple the component to the wall; and

closing said at least two of the molds to define an enclosed mold cavity and join together again the severed portions of the parison.

2. The method of claim 1 which also includes permitting the wall of the parison to cool with said portion of the component still overlapped by the wall.

3. The method of claim 1 wherein at least one of said molds includes a recess and disposing a component adjacent to a wall of the parison is accomplished by pressing a surface of the component against the wall to displace a portion of the parison into the recess.

4. The method of claim 3 wherein at least one tool is provided adjacent to said recess and overlapping a portion of the component with a portion of the wall of the parison is accomplished by advancing the tool toward the component to displace a portion of the wall of the parison about the component.

5. The method of claim 1 wherein at least one mold includes a tool and overlapping a portion of the component with a portion of the wall of the parison is accomplished by advancing the tool toward the component to displace a portion of the wall of the parison about the component.

6. The method of claim 5 wherein more than one tool is used to overlap multiple portions of the component with a portion of the wall of the parison by advancing the tools toward the component to displace different portions of the wall of the parison about the component.

7. The method of claim 1 wherein the parison is in two separate halves when the molds are separated.

Assignments (2)
CHANGE OF NAME Recorded May 19, 2026
From: TI AUTOMOTIVE HOLDINGS GMBH
To: TI FLUID SYSTEMS ENGINEERING GMBH
Reel/Frame 075587/0854 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2011
From: GRAUER, PETER
To: TI AUTOMOTIVE TECHNOLOGY CENTER GMBH
Reel/Frame 025872/0213 →