Method for the connection of two wafers, and a wafer arrangement
View Patent ↗A method for the connection of two wafers in which a contact area is formed between the two wafers by placing the two wafers one on top of the other. The contact area is heated locally and for a limited time. A wafer arrangement comprises two wafers which have been placed one on top of the other and between whose opposite surfaces a contact area is located. The wafers are connected to one another at selected areas of the contact area.
1. A wafer arrangement, comprising:
two wafers placed one on top of the other; and
a contact area between planar surfaces of the two wafers; wherein:
the two wafers are connected to one another at selected connection areas of the contact area,
at least one of the two wafers is a silicon wafer, a germanium wafer, a gallium arsenide wafer, an InP wafer, a ceramic wafer or a GaP wafer,
a mechanical joint between the two wafers is mediated or effected by a material between the planar surfaces of the two wafers, wherein said material is applied as a continuous layer entirely covering the planar surfaces of the two wafers in the contact area, wherein the contact area comprises connection-free areas arranged therein where there is no mechanical joint between the two wafers,
at least one of the two wafers comprises two or more individual layers, and
at least one of the two or more individual layers is an epitaxially applied layer comprising an active layer configured to produce or to detect radiation, and wherein at least one of the two or more individual layers is part of an optoelectronic component.
2. The wafer arrangement as claimed in claim 1 , wherein the mechanical joint between the two wafers comprises junction points in the contact area.
3. The wafer arrangement as claimed in claim 2 , wherein the junction points are arranged at nodes of a regular network.
4. The wafer arrangement as claimed in claim 1 , wherein one of the wafers is a growth substrate for the epitaxially applied layer.
5. The wafer arrangement as claimed in claim 1 , wherein each of the two wafers has the same length in a lateral direction.
6. The wafer arrangement as claimed in claim 1 , wherein at least one additional material is applied to one of the wafers, the additional material being different from the material.
7. The wafer arrangement as claimed in claim 6 , wherein the at least one additional material is solder.
8. The method as claimed in claim 7 , wherein the solder is selected from the following materials: Au, AuSn, Pd, In and Pt.
9. The wafer arrangement as claimed in claim 6 , wherein the at least one additional material is mixed in a melt.
10. The wafer arrangement as claimed in claim 1 , wherein at least one of the two wafers is transparent with respect to a laser beam.
11. The wafer arrangement as claimed in claim 10 , wherein the material is not transparent to the laser beam.
12. The wafer arrangement as claimed in claim 1 , wherein the epitaxially applied layer comprises at least one of the following semiconductor materials: GaInN, AlGaAs, AlGaInP, GaP, InP, InGaAs, InGaAsP, GaN and AlGaInN.
13. The wafer arrangement as claimed in claim 1 , wherein at least one of the two wafers comprises at least one of the following materials: Mo, Cu and CuW.
14. The wafer arrangement as claimed in claim 1 , wherein a sum of the surface areas of the contact area in which the two wafers are connected to one another is less than a sum of the surface areas of the contact area in which there is no connection between the two wafers.
15. The wafer arrangement as claimed in claim 1 , wherein the two wafers are not connected to one another at separation points of the wafer arrangement.
16. A wafer arrangement, comprising:
two wafers placed one on top of the other; and
a contact area between planar surfaces of the two wafers, wherein:
the two wafers are connected to one another at selected connection areas of the contact area, and
a mechanical joint between the two wafers is mediated or effected by a material between the planar surfaces of the two wafers, wherein said material is applied as a continuous layer entirely covering the planar surfaces of the two wafers in the contact area, wherein the contact area comprises connection-free areas arranged therein where there is no mechanical joint between the two wafers.
17. The wafer arrangement as claimed in claim 16 , wherein the mechanical joint between the two wafers comprises junction points in the contact area.
18. The wafer arrangement as claimed in claim 17 , wherein the junction points are arranged at nodes of a regular network.
19. The wafer arrangement as claimed in claim 16 , wherein at least one of the wafers includes at least one temperature-sensitive layer, such that a maximum temperature to which the temperature-sensitive layer can be heated without damage is lower than a temperature at which the two wafers are joined together.
20. The wafer arrangement as claimed in claim 16 , wherein a sum of the surface areas of the contact area in which the two wafers are connected to one another is less than a sum of the surface areas of the contact area in which there is no connection between the two wafers.
21. The wafer arrangement as claimed in claim 16 , wherein the two wafers are not connected to one another at separation points of the wafer arrangement.