Method of producing a semiconductor device having a trench filled with an epitaxially grown semiconductor layer
View Patent ↗A method of producing a device includes embedding trenches with an epitaxial layer having high crystallinity while a mask oxide film remains unremoved. An n-type semiconductor is formed on the surface of a silicon substrate, and a mask oxide film and a mask nitride film are formed on the surface of the n-type semiconductor. The mask laminated film is opened by photolithography and etching, and trenches are formed in the silicon substrate. The width of the remaining mask laminated film is narrowed and portions of the n-type semiconductor close to the opening ends of the trenches are exposed. The trenches are embedded with a p-type semiconductor and the surface of the mask laminated film is prevented from being covered with the p-type semiconductor. The p-type semiconductor is grown from the second exposed portions of the n-type semiconductor. V-shaped grooves are prevented from forming on the surface of the p-type semiconductor.
1. A method of producing a semiconductor device, the method comprising:
a masking step of forming a mask being open partially on the main face of a first conductive type semiconductor substrate;
an etching step of forming trenches by etching the semiconductor portions of the first conductive type semiconductor substrate exposed to the opening portions in the mask;
an exposing step of widening the width of each opening portion in the mask, and exposing the semiconductor portions on the surface of the first conductive type semiconductor substrate, remaining without being etched after the etching step; and
a layer forming step of epitaxially growing a second conductive type semiconductor layer in the trenches to fill the trenches completely and the semiconductor portions of the first conductive type semiconductor substrate exposed in the exposing step,
wherein the layer forming step form grows the second conductive type semiconductor layer so that an upper surface of the second conductive type semiconductor layer is situated higher than an upper surface of the first conductive type semiconductor substrate but lower than an upper surface of the mask.
2. The method of producing a semiconductor device according to claim 1 , wherein the width of the opening portions in the mask is widened by using another mask formed of a resist film, a nitride film or an oxide film in the exposing step.
3. The method of producing a semiconductor device according to claim 1 , wherein the mask is formed of an oxide film, a nitride film, or a laminated film of an oxide film and a nitride film.
4. The method of producing a semiconductor device according to claim 1 , wherein the layer forming step performs epitaxial growth inside a chamber to which a mixed gas of a silicon source gas and a halide gas is supplied.
5. The method of producing a semiconductor device according to claim 1 , wherein the mask is a laminate mask composed of a first layer and a second layer above the first layer.
6. The method of producing a semiconductor device according to claim 5 , wherein the width of the opening portions in the laminate mask is widened by using another mask formed of a resist film, a nitride film or an oxide film in the exposing step.
7. The method of producing a semiconductor device according to claim 5 , wherein the layer forming step form grows the second conductive type semiconductor layer so that the upper surface of the second conductive type semiconductor layer is situated lower than an upper surface of the second layer of the laminate mask but higher than an upper surface of the first layer of the laminate mask.
8. A method of producing a semiconductor device, the method comprising:
a first masking step of forming a first mask being open partially on the main face of a first conductive type semiconductor substrate;
an etching step of forming trenches by etching the semiconductor portions of the first conductive type semiconductor substrate exposed to the opening portions in the first mask;
an exposing step of widening the width of each opening portion in the first mask, and exposing the semiconductor portions on the surface of the first conductive type semiconductor substrate, remaining without being etched after the etching step; and
a layer forming step of epitaxially growing a second conductive type semiconductor layer in the trenches and the semiconductor portions of the first conductive type semiconductor substrate exposed in the exposing step,
wherein the width of the opening portions in the first mask is widened by using a mask formed of a resist film, a nitride film or an oxide film in the exposing step.