Granted Patent B2

US 8,898,893 · App. 12/968,385 · Granted Dec 2, 2014

Abstract

Claims (29)

1. A method for applying a fluid to a component during a placement cycle, the method comprising:

(a) providing a component placement machine including a housing, the housing adapted for movement along an X and a Y axis above a printed circuit board, the housing having a frame attached thereto, the frame having a pick and place head disposed thereupon;

(b) providing a fluid application station contiguous with the housing and adapted to apply fluid to the component;

(c) moving the housing to a pick location;

(d) picking the component from a supply of components using the pick and place head;

(e) moving the housing to a predetermined location;

(f) applying fluid to the picked component; and

(g) placing the picked component with the fluid applied onto the printed circuit board at said predetermined location;

wherein said fluid application step (f) is accomplished at least substantially during at least one of said moving step (e), and said placing step (g).

2. The method of claim 1 , further comprising rotating a belt of the fluid application station, wherein the belt is configured to apply the fluid to the picked component in step (f).

3. The method of claim 1 , further comprising removing the fluid application station from the housing for easier access to the fluid application station and reattaching the fluid application station to the housing.

4. The method of claim 1 , further comprising:

determining if fluid needs to be applied the picked component; and

performing step (g) only for those picked components determined to require the application of fluid.

5. The method of claim 1 , further comprising:

providing a plurality of pick and place heads on the frame; and

repeating at least steps (d), (e) and (g) for an additional component.

6. A method for applying a fluid to a component during a placement cycle, the method comprising:

(a) providing a component placement machine including a housing, the housing adapted for movement along an X and a Y axis above a printed circuit board, the housing having a frame rotatably attached thereto, said frame having a plurality of pick and place heads disposed thereupon;

(b) providing a fluid application station attached to the housing and adapted to apply fluid to the component;

(c) picking the component from a supply of components using at least one of the plurality of pick and place heads;

(d) applying fluid to the picked component;

(e) moving the housing to a predetermined location; and

(f) placing the picked component with the fluid applied onto the printed circuit board at a the predetermined location;

further comprising repeating steps (c) to (e) for an additional component, wherein said fluid application step (d) is accomplished at least substantially during at least one of said repeated picking step (c) of the additional component.

7. The method of claim 6 , wherein said placing step (e) is accomplished substantially during the repeated fluid application step (d) for the additional component.

8. The method of claim 6 , wherein said fluid application step (d) comprises means for extending at least one of a plurality of the pick and place heads such that the fluid is applied to the component by the fluid application station.

9. The method of claim 6 , further comprising determining whether fluid needs to be applied to the picked component and performing step (g) only for those picked components determined to require the application of fluid.

10. The method of claim 6 , further comprising removing the fluid application station from the housing for easier access to the fluid application station and reattaching the fluid application station to the housing.

Assignments (6)