IP Library Granted Patent US 8,778,115
Granted Patent B2
US 8,778,115 · App. 12/969,365 · Granted Jul 15, 2014

Mask, method of manufacturing mask and apparatus for manufacturing mask

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Quick Facts
Patent No.
US 8,778,115
App. No.
12/969,365
Granted
Jul 15, 2014
Kind
B2
Abstract

A method of efficiently manufacturing a large-sized mask is disclosed. In one embodiment, the method includes: 1) providing a first mask member comprising i) a first pattern unit having a plurality of slits, ii) a first buffer unit spaced apart from the first pattern unit, and iii) a first bonding unit interconnecting the first pattern unit and the first buffer unit and 2) providing a second mask member comprising i) a second pattern unit having a plurality of slits, ii) a second buffer unit spaced apart from the second pattern unit, and iii) a second bonding unit interconnecting the second pattern unit and the second buffer unit. The method may further include contacting the first bonding unit and the second bonding unit; and connecting the first mask member to the second mask member while tensile forces are applied to the first mask member and the second mask member.

Claims (41)

1. A method of manufacturing a mask, the method comprising:

providing a first mask member comprising i) a first pattern unit having a plurality of slits, ii) a first buffer unit spaced apart from the first pattern unit, and iii) a first bonding unit interconnecting the first pattern unit and the first buffer unit;

providing a second mask member comprising i) a second pattern unit having a plurality of slits, ii) a second buffer unit spaced apart from the second pattern unit, and iii) a second bonding unit interconnecting the second pattern unit and the second buffer unit;

contacting the first bonding unit and the second bonding unit; and

connecting the first mask member to the second mask member while tensile forces are applied to the first mask member and the second mask member, wherein the tensile forces are applied to the first mask member while the first pattern unit and the first buffer unit are formed on different planes.

2. The method of claim 1 , further comprising: before applying the tensile forces, disposing the first mask member and the second mask member on a base substrate having a predetermined pattern,

wherein a through-hole is defined in the base substrate, wherein the through-hole has a width that is greater than the width of the first mask member, and wherein one end of the first buffer unit of the first mask member passes through the through-hole.

3. The method of claim 2 , wherein at least part of the slits of the first pattern unit and at least part of the slits of the second pattern unit are formed substantially directly above the corresponding pattern of the base substrate.

4. The method of claim 1 , wherein each of the first and second mask members has first and second ends opposing each other, wherein the first ends are formed on the first and second pattern units, respectively, wherein the second ends are formed on the first and second buffer units, respectively, and wherein the tensile forces are applied to i) the first and second ends of the first mask member and ii) the first and second ends of the second mask member.

5. The method of claim 1 , further comprising removing the first and the second buffer units after the first and the second mask members are connected to each other.

6. The method of claim 1 , wherein the width of the first pattern unit is substantially the same as that of the second pattern unit.

7. The method of claim 1 , further comprising:

providing a first roller member so as to contact at least the border region between the first bonding unit and the first buffer unit;

before the tensile forces are applied to the first mask member, disposing the first pattern unit and the first buffer unit on different planes with respect to the first roller member;

providing a second roller member so as to contact at least the border region between the second bonding unit and the second buffer unit; and

before the tensile forces are applied to the second mask member, disposing the second pattern unit and the second buffer unit on different planes with respect to the second roller member.

8. The method of claim 1 , further comprising: disposing the first pattern unit of the first mask member and the second pattern unit of the second mask member in a direction substantially parallel to the direction of gravity, and wherein tensile forces are applied to the first mask member and the second mask member to connect the first mask member and the second mask member.

9. The method of claim 1 , further comprising:

disposing the second buffer unit above the first pattern unit; and

disposing the second pattern unit above the first buffer unit,

wherein i) the distance between the first pattern unit and the second buffer unit and ii) the distance between the second pattern unit and the first buffer unit substantially gradually increase from inner ends to outer ends of the first and second buffer units, wherein the inner and outer ends are opposing each other, and wherein the inner ends of the buffer units are adjacent to the borders between the pattern units and the corresponding bonding units.

10. The method of claim 1 , wherein the first pattern unit and the second pattern unit are disposed on substantially the same plane after the first mask member and the second mask member are connected to each other.

11. The method of claim 1 , wherein the first and second mask members are connected to each other by welding.

12. A method of manufacturing a mask, the method comprising:

providing a first mask member comprising i) a first pattern unit having a plurality of slits, ii) a first buffer unit spaced apart from the first pattern unit, and iii) a first bonding unit interconnecting the first pattern unit and the first buffer unit;

providing a second mask member comprising i) a second pattern unit having a plurality of slits, ii) a second buffer unit spaced apart from the second pattern unit, and iii) a second bonding unit interconnecting the second pattern unit and the second buffer unit;

contacting the first bonding unit and the second bonding unit; and

connecting the first mask member to the second mask member while tensile forces are applied to the first mask member and the second mask member,

wherein the first bonding unit of the first mask member is separately prepared and connected to the first pattern unit.

13. The method of claim 12 , wherein the first pattern unit and the first bonding unit are connected to each other by welding.

14. The method of claim 12 , wherein the first bonding unit is disposed under the first pattern unit such that one end of the first pattern overlaps one end of the first bonding unit, and wherein the second mask member is connected to a portion of the first bonding unit where the first pattern unit and the first bonding unit do not overlap each other.

15. The method of claim 12 , wherein the first bonding unit and the first buffer unit are integrally formed.

16. The method of claim 12 , wherein the second pattern unit, the second bonding unit and the second buffer unit are integrally formed.

17. A method of manufacturing a mask, the method comprising:

providing a first mask member comprising i) a first pattern unit having a plurality of slits, ii) a first buffer unit spaced apart from the first pattern unit, and iii) a first bonding unit interconnecting the first pattern unit and the first buffer unit;

providing a second mask member comprising i) a second pattern unit having a plurality of slits, ii) a second buffer unit spaced apart from the second pattern unit, and iii) a second bonding unit interconnecting the second pattern unit and the second buffer unit;

contacting the first bonding unit and the second bonding unit; and

connecting the first mask member to the second mask member while tensile forces are applied to the first mask member and the second mask member,

wherein the first bonding unit of the first mask member is thinner than the first pattern unit, and wherein the second bonding unit of the second mask member is thinner than the second pattern unit.

18. The method of claim 17 , wherein the total thickness of the first bonding unit and the second bonding unit is substantially the same as that of the first pattern unit or the second pattern unit.

19. The method of claim 17 , wherein the first pattern unit, the first bonding unit and the first buffer unit of the first mask member are integrally formed, and the second pattern unit, the second bonding unit and the second buffer unit of the second mask member are integrally formed.

Assignments (1)
MERGER Recorded Aug 31, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028921/0334 →