Back-illuminated type solid-state imaging device
View Patent ↗A method for manufacturing a back-illuminated type solid-state imaging device by (a) providing a substrate having, on a front surface side thereof, a semiconductor film on a semiconductor substrate with an insulation film therebetween; (b) forming in the semiconductor substrate a charge accumulation portion of a photoelectric conversion element that constitutes a pixel; (c) forming in the semiconductor film at least some transistors that constitute the pixel; and (d) forming on a rear surface side of the semiconductor substrate a rear surface electrode to which a voltage can be applied.
1. A method for manufacturing a back-illuminated type solid-state imaging device, comprising the steps of: providing a silicon on insulator (SOI) substrate having a semiconductor film on a front surface side of a semiconductor substrate, an insulation film between the semiconductor film and the semiconductor substrate; forming in the semiconductor substrate a charge accumulation portion of a photoelectric conversion element that constitutes a pixel; forming in the semiconductor film at least some transistors that constitute the pixel; and forming on a rear surface side of the semiconductor substrate a rear surface electrode to which a voltage can be applied.
2. A method for manufacturing a back-illuminated type solid-state imaging device according to claim 1 , wherein, the semiconductor substrate is formed of a high resistance substrate so as to be depleted from the front surface to the rear surface of the substrate with the voltage applied to the rear surface electrode.
3. A method for manufacturing a back-illuminated type solid-state imaging device according to claim 2 , further comprising the step of: forming on the rear surface side of the semiconductor substrate a charge injection preventive film before forming the rear surface electrode.
4. A method for manufacturing a back-illuminated type solid-state imaging device according to claim 2 , further comprising the step of: forming in the semiconductor substrate, under the insulation film, a semiconductor layer with a conductivity type opposite that of the charge accumulation portion of the photoelectric conversion element.
5. A manufacturing method of a back-illuminated type solid-state imaging device according to claim 2 , wherein the step of forming some transistors in the semiconductor film comprises forming a transfer transistor.
6. A manufacturing method of a back-illuminated type solid-state imaging device according to claim 2 , further comprising the step of: forming in the semiconductor substrate a transfer transistor which is among the transistors constituting the pixel, wherein, the photoelectric conversion element is a buried type.