IP Library Granted Patent US 9,056,981
Granted Patent B2
US 9,056,981 · App. 12/972,811 · Granted Jun 16, 2015

Polyamide resin composition with good reflectance, impact strength, heat resistance, and water resistance and method of preparing the same

Inventors: Pil Ho Kim (Uiwang-si, KR); In Sik Shim (Uiwang-si, KR); Jong Cheol Lim (Uiwang-si, KR); Sun Mi Park (Uiwang-si, KR)
Assignee: Cheil Industries Inc.
C08L77/00C08K7/14C08K2003/2241C08L51/06
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Quick Facts
Patent No.
US 9,056,981
App. No.
12/972,811
Granted
Jun 16, 2015
Kind
B2
Abstract

The present invention provides a polyamide resin composition comprising (A) about 100 parts by weight of polyamide resin; (B) about 0.1 to about 50 parts by weight of titanium dioxide; and (C) about 1 to about 20 parts by weight of modified polyolefin, wherein the (C) modified polyolefin is prepared by grafting a monomer that is partially miscible with the polyamide resin into the main chain of the polyolefin.

Claims (24)

1. A polyamide resin composition comprising:

(A) about 100 parts by weight of polyamide resin;

(B) about 5 to about 50 parts by weight of titanium dioxide; and

(C) about 1 to about 15 parts by weight of modified polyolefin,

wherein the (C) modified polyolefin is prepared by grafting a monomer that is partially miscible with the polyamide resin into the main chain of the polyolefin, and wherein the (C) modified polyolefin comprises greater than 10% by weight to about 50% by weight of the monomer that is partially miscible with the polyamide resin.

2. The polyamide resin composition of claim 1 , wherein the (A) polyamide resin includes repeating units of dicarboxylic acid and aliphatic diamine, alicyclic diamine, or a combination thereof.

3. The polyamide resin composition of claim 1 , wherein the (A) polyamide resin is represented by Formula 1 below:

wherein n is an integer of 50 to 500.

4. The polyamide resin composition of claim 1 , wherein the main chain of the modified polyolefin includes about 70 to about 100% by weight of polyethylene, polypropylene, or ethylene-propylene copolymer.

5. The polyamide resin composition of claim 1 , wherein the monomer that is partially miscible with the polyamide resin comprises a (meth)acrylic acid C1-C10 alkyl ester, a modified ester, or a combination thereof.

6. The polyamide resin composition of claim 5 , wherein the monomer that is partially miscible with the polyamide resin comprises a (meth)acrylic acid C1-C10 alkyl ester.

7. The polyamide resin composition of claim 6 , wherein the monomer that is partially miscible with the polyamide resin comprises methyl acrylate, ethyl acrylate, butyl acrylate, or a combination thereof.

8. The polyamide resin composition of claim 5 , wherein the modified ester comprises an unsaturated ethylene group and a functional group.

9. The polyamide resin composition of claim 8 , wherein the functional group comprises epoxide, ethylene glycol, C6-C12 arylate, or CN.

10. The polyamide resin composition of claim 8 , wherein the modified ester comprises glycidyl (meth)acrylate, ethylene glycol modified (meth)acrylate, C6-C12 arylate modified (meth)acylate, acrylonitrile, or a combination thereof.

11. The polyamide resin composition of claim 1 , wherein the polyamide resin composition further comprises greater than 0 to about 60 parts by weight of (D) filler.

12. The polyamide resin composition of claim 11 , wherein the (D) filler is glass fiber.

13. The polyamide resin composition of claim 1 , wherein the polyamide resin composition exhibits an initial reflectance value at a wavelength of 440 nm of more than about 85 as measured according to CIE Lab color difference evaluation criteria using a Minolta 3600D spectrophotometer, and a decline of reflectance value of less than about 15 when measured again after maintaining the polyamide resin composition under conditions of 85° C. and relative humidity of 85% for 96 hours.

14. The polyamide resin composition of claim 1 , wherein the polyamide resin composition exhibits a change of initial yellow index (ΔYI) of less than about 10 as measured according to CIE Lab color difference evaluation criteria using a Minolta 3600D spectrophotometer after maintaining the polyamide resin composition under condition of 85° C. and relative humidity of 85% for 96 hours.

15. A method of producing a polyamide resin composition comprising mixing (A) about 100 parts by weight of polyamide resin; (B) about 5 to about 50 parts by weight of titanium dioxide; and (C) about 1 to about 20 parts by weight of modified polyolefin, wherein the modified polyolefin is prepared by grafting a monomer that is partially miscible with the polyamide resin into the main chain of the polyolefin, and wherein the (C) modified polyolefin comprises greater than 10% by weight to about 50% by weight of the monomer that is partially miscible with the polyamide resin.

16. The method of producing a polyamide resin composition of claim 15 , wherein the monomer that is partially miscible with the polyamide resin comprises a (meth)acrylic acid C1-C10 alkyl ester, a modified ester, or a combination thereof.

17. The method of producing a polyamide resin composition of claim 15 , wherein the polyamide resin composition further comprises greater than 0 to about 60 parts by weight of (D) filler.

18. An article prepared from the polyamide resin composition of claim 1 .

19. The article of claim 18 , wherein the article is a reflector for a LED.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2010
From: KIM, PIL HO; SHIM, IN SIK; LIM, JONG CHEOL; PARK, SUN MI
To: CHEIL INDUSTRIES INC.
Reel/Frame 025527/0899 →
Priority Claims (1)
KR 10-2009-0132226 · Dec 28, 2009 · national
Continuity (1)
Related Publication 20110160378A1 · Jun 30, 2011