Method for manufacturing antenna
A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.
1. A method for manufacturing an antenna, the method comprising:
providing a substrate, wherein a surface of the substrate has an antenna region;
electroless plating the surface of the substrate with a metal medium, so that the surface is covered with the metal medium;
covering the metal medium with a resist;
removing a portion of the resist in the antenna region;
electroplating the antenna region with metal material to form an antenna main body;
removing a remaining portion of the resist; and
excluding a portion of the metal medium in the antenna region, removing the other portion of the metal medium from the substrate.
2. The method of claim 1 , wherein the antenna region has antenna pattern.
3. The method of claim 1 , further comprising:
roughening the surface of the substrate.
4. The method of claim 1 , further comprising:
forming a recess in the antenna region.
5. The method of claim 1 , wherein the material of the metal medium is palladium or polymeric material.
6. The method of claim 1 , further comprising:
exposing the portion of the metal medium to the antenna region by removing the portion of the resist in the antenna region.
7. The method of claim 1 , wherein the remaining portion of the resist is removed through dry etching.
8. The method of claim 7 , wherein the dry etching is laser carving.
9. The method of claim 1 , wherein the metal material is copper, nickel or gold.