Electronic device substrate, electronic device, method of manufacturing electronic device substrate, method of manufacturing electronic device, and electronic apparatus
View Patent ↗An electronic device substrate includes a resin layer, a semiconductor layer disposed in a first region on the resin layer, a plurality of insulating films disposed in the first region on the resin layer, and connection terminals disposed in a second region on the resin layer, the connection terminals being used for connection to an external component to be connected. The connection terminals in plan view do not overlap with any insulating films composed of an inorganic material among the plurality of insulating films.
1. An electronic device substrate comprising:
a resin layer;
a semiconductor layer disposed in a first region on the resin layer;
a plurality of insulating films disposed in the first region on the resin layer; and
connection terminals disposed in a second region on the resin layer, the connection terminals being used for connection to an external component to be connected,
wherein the connection terminals in plan view do not overlap with any insulating films composed of an inorganic material among the plurality of insulating films.
2. An electronic device comprising:
the electronic device substrate according to claim 1 ; and
an external component to be connected which has been connected to the connection terminals through a thermosetting adhesive.
3. A method of manufacturing an electronic device substrate, the electronic device substrate including a resin layer, a semiconductor layer disposed in a first region on the resin layer, a plurality of insulating films disposed in the first region on the resin layer, and connection terminals disposed in a second region on the resin layer, the connection terminals being used for connection to an external component to be connected, the method comprising:
forming the semiconductor layer and the plurality of insulating films in the first region on the resin layer; and
forming the connection terminals in the second region on the resin layer such that the connection terminals in plan view do not overlap with any insulating films composed of an inorganic material among the plurality of insulating films.
4. A method of manufacturing an electronic device, the electronic device including an electronic device substrate manufactured by the method of manufacturing an electronic device substrate according to claim 3 and an external component to be connected, the method further comprising connecting the external component to be connected to the connection terminals through a thermosetting adhesive.