IP Library Granted Patent US 8,520,366
Granted Patent B2
US 8,520,366 · App. 12/975,662 · Granted Aug 27, 2013

Solid electrolytic capacitor and method of manufacture

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Quick Facts
Patent No.
US 8,520,366
App. No.
12/975,662
Granted
Aug 27, 2013
Kind
B2
Abstract

An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.

Claims (18)

1. A method of forming a solid electrolytic capacitor comprising:

forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from said anode;

forming a dielectric on said anode;

forming a cathode layer on said dielectric;

encasing said anode, said dielectric, and said cathode layer in a non-conducting material encasement;

exposing said anode lead extension outside of said encasement at a side surface;

adhering a conductive metal layer to said anode lead extension; and

electrically connecting a preformed solid metal terminal to said conductive metal layer at said side surface.

2. The method of forming a solid electrolytic capacitor of claim 1 wherein said preformed solid metal terminal is L shaped with a width which is at least 0.4 mm less than the maximum width of said encasement.

3. The method of forming a solid electrolytic capacitor of claim 2 wherein said L shaped preformed solid metal terminal is applied to a bottom face of said capacitor.

4. The method of forming a solid electrolytic capacitor of claim 3 wherein a portion of said L shaped preformed solid metal terminal is adhered to said encasement with an adhesive.

5. The method for forming a capacitor of claim 3 wherein said first face and said second face are on opposing sides of said encasement and said anode terminal and cathode terminal are symmetric.

6. The method of forming a solid electrolytic capacitor of claim 1 wherein said anode lead extension is a valve metal or a conductive oxide of a valve metal.

7. The method of forming a solid electrolytic capacitor of claim 1 wherein said adhering is by a method selected from metal flame spray, chemical vapor deposition, metal sputtering, electroplating, electroless plating and powder metal sintering.

8. The method of forming a solid electrolytic capacitor of claim 1 further comprising zincating said anode lead extension prior to said adhering.

9. The method of forming a solid electrolytic capacitor of claim 8 wherein said conductive metal layer is nickel.

10. The method of forming a solid electrolytic capacitor of claim 1 wherein said electrically connecting comprises a method selected from soldering, conductive adhesive bonding, brazing, nano foil bonding, ultrasonic welding, laser welding, resistance welding and low temperature sintering.

11. The method of forming a solid electrolytic capacitor of claim 1 wherein said cathode layer comprises an intrinsically conductive polymer.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2011
From: SUMMEY, BRANDON; POLTORAK, JEFFREY; LESSNER, PHILIP M.; QIU, YONGJIAN; HAHN, RANDOLPH S.; JACOBS, DAVID; BRENNEMAN, KEITH R.; HARRINGTON, ALBERT; STOLARSKI, CHRIS
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 025701/0708 →