IP Library Granted Patent US 8,139,327
Granted Patent B2
US 8,139,327 · App. 12/977,624 · Granted Mar 20, 2012

Semiconductor integrated circuit

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Quick Facts
Patent No.
US 8,139,327
App. No.
12/977,624
Granted
Mar 20, 2012
Kind
B2
Abstract

An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.

Claims (27)

1. A semiconductor integrated circuit on a semiconductor chip, the semiconductor integrated circuit comprising:

a first area which includes a plurality of terminals for connection to an outside of said semiconductor chip;

a second area which includes a plurality of buffers and protection circuits connected to said terminals, and a plurality of voltage regulators which step down a first power voltage which is supplied from outside of the semiconductor integrated circuit to one of said terminals to produce an internal power voltage which is lower than the first power voltage; and

a third area which includes a first internal circuit which operates based on the internal power voltage,

wherein at least one of the voltage regulators is disposed near a corner of the semiconductor chip in the second area.

2. The semiconductor integrated circuit according to claim 1 , further comprising:

a fourth area which includes a driver control circuit to control at least one power transistor outside the semiconductor chip and connected to the semiconductor chip, said at least one power transistor generating an external power voltage in response to said driver control circuit.

3. The semiconductor integrated circuit according to claim 2 , further comprising:

a power line connected to the plurality of voltage regulators,

wherein the power line is connected to at least one of the terminals and is formed to be a closed loop.

4. The semiconductor integrated circuit according to claim 3 ,

wherein at least one external stabilizing capacitor is connected to the terminal connected to the power line.

5. The semiconductor integrated circuit according to claim 3 ,

wherein the terminal connected to the power line is arranged to be at a position near one of the voltage regulators.

6. The semiconductor integrated circuit according to claim 2 ,

wherein each said voltage regulator is a series regulator.

7. The semiconductor integrated circuit according to claim 6 , further comprising:

a reference voltage generation circuit that provides a reference voltage for a step-down voltage to the series regulators.

8. A semiconductor integrated circuit on a semiconductor chip, the semiconductor integrated circuit comprising:

a first area which includes a plurality of terminals for connection to an outside of said semiconductor chip;

a second area which includes a plurality of buffers and protection circuits connected to said terminals, and a plurality of voltage regulators which step down a first power voltage which is supplied from outside of the semiconductor integrated circuit to one of said terminals to produce an internal power voltage which is lower than the first power voltage;

a third area which includes a first internal circuit which operates based on the internal power voltage; and

a fourth area which includes a control circuit to control operation of the voltage regulators and a driver control circuit to control at least one power transistor outside the semiconductor chip and connected to the semiconductor chip, said at least one power transistor generating an external power voltage in response to said driver control circuit.

9. The semiconductor integrated circuit according to claim 8 ,

wherein the driver control circuit operates based on the first power voltage.

10. The semiconductor integrated circuit according to claim 8 , further comprising:

a sub regulator which steps down the first power voltage and supplies the internal power voltage to the driver control circuit.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2015
From: HITACHI DEVICE ENGINEERING CO., LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 036667/0622 →
MERGER AND CHANGE OF NAME Recorded Sep 23, 2015
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036667/0733 →