Granted Patent B2

US 8,672,516 · App. 12/979,573 · Granted Mar 18, 2014

Abstract

Claims (37)

1. A heat sink comprising:

a heat sink body;

a reflective layer disposed over the heat sink body that has reflectivity greater than 90% for light in the visible spectrum; and

a light transmissive protective layer disposed over the reflective layer that is light transmissive for light in the visible spectrum.

2. The heat sink of claim 1 , wherein the reflective layer comprises a specularly reflective layer.

3. The heat sink of claim 1 , wherein the multilayer structure including the reflective layer and the light transmissive protective layer comprises a specular reflector having less than 10% light scattering.

4. The heat sink of claim 1 , wherein the multilayer structure including the reflective layer and the light transmissive protective layer comprises a specular reflector having less than 5% light scattering.

5. The heat sink of claim 1 , wherein the heat sink body comprises:

a structural heat sink body; and

a thermally conductive layer disposed over the structural heat sink body, the thermally conductive layer having higher thermal conductivity than the structural heat sink body, the reflective layer being disposed over the thermally conductive layer.

6. The heat sink of claim 5 , wherein the thermally conductive layer has a thickness of 500 micron or less and a thermal conductivity of 50 W/m·K or higher.

7. The heat sink of claim 5 , wherein the thermally conductive layer has a thickness of at least 150 micron and a thermal conductivity of 500 W/m·K or higher.

8. The heat sink of claim 5 , wherein the structural heat sink body comprises a plastic or polymeric structural heat sink body.

9. The heat sink of claim 5 , wherein the thermally conductive layer comprises a copper (Cu) layer.

10. The heat sink of claim 1 , wherein the light transmissive protective layer is light absorbing for infrared light and is optically thick for infrared light.

11. The heat sink of claim 1 , wherein the light transmissive protective layer has a thickness greater than or equal to 1 micron.

12. The heat sink of claim 1 , wherein the light transmissive protective layer has a thickness greater than or equal to 5 microns.

13. The heat sink of claim 1 , wherein the light transmissive protective layer has a thickness greater than or equal to 10 microns.

14. The heat sink of claim 1 , wherein the light transmissive protective layer has a thickness of no more than 15 microns.

15. The heat sink of claim 1 , wherein the light transmissive protective layer comprises a silicon dioxide (SiO 2 ) or silica layer.

16. The heat sink of claim 1 , wherein the light transmissive protective layer comprises a light transmissive plastic, polymer, glass, or ceramic layer.

17. The heat sink of claim 1 , wherein the reflective layer comprises a silver (Ag) layer.

18. The heat sink of claim 1 , wherein the reflective layer is of sufficient thickness that incident light is reflected without an evanescent wave passing through the specularly reflective layer.

19. The heat sink of claim 1 , wherein the heat sink body includes heat radiating surface area enhancing structures and the reflective layer and the light transmissive protective layer are disposed over at least the heat radiating surface area enhancing structures.

20. The heat sink of claim 19 , wherein the heat radiating surface area enhancing structures comprise heat radiating fins.

21. The heat sink of claim 1 , wherein the heat sink defines a hollow light collecting reflector and the reflective layer and the light transmissive protective layer are disposed over at least an inner surface of the hollow light collecting reflector.

22. The heat sink of claim 21 , wherein the heat sink includes inwardly extending fins disposed inside the hollow light collecting reflector and the reflective layer and the light transmissive protective layer are additionally disposed over at least the inwardly extending fins.

23. A light emitting diode (LED)-based lamp comprising:

a heat sink including a heat sink body, a reflective layer disposed over the heat sink body that has reflectivity greater than 90% for light in the visible spectrum, and a light transmissive protective layer disposed over the reflective layer that is light transmissive for light in the visible spectrum; and

an LED module secured with and in thermal communication with the heat sink.

24. The LED-based lamp of claim 23 , wherein:

the LED-based lamp has an A-line bulb configuration and further includes a diffuser illuminated by the LED module; and

the heat sink includes fins disposed inside or outside the diffuser and the reflective layer and the light transmissive protective layer are disposed over at least the fins.

25. The LED-based lamp of claim 24 , wherein the diffuser is hollow and the heat sink includes tins disposed inside the hollow diffuser.

26. The LED-based lamp of claim 23 , wherein the LED-based lamp comprises a directional lamp, the heat sink defines a hollow light-collecting reflector, and the reflective layer and the light transmissive protective layer are disposed over at least an inner surface of the hollow light collecting reflector.

27. The LED-based lamp of claim 26 , wherein the heat sink includes inwardly extending fins disposed inside the hollow light collecting reflector and the reflective layer and the light transmissive protective layer are additionally disposed over at least the inwardly extending fins.

28. The LED-based lamp of claim 23 , wherein the heat sink comprises a reflective optical component of the LED-based lamp.

Assignments (6)