IP Library Granted Patent US 8,096,642
Granted Patent B2
US 8,096,642 · App. 12/980,204 · Granted Jan 17, 2012

Inkjet nozzle with paddle layer arranged between first and second wafers

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Quick Facts
Patent No.
US 8,096,642
App. No.
12/980,204
Granted
Jan 17, 2012
Kind
B2
Abstract

An inkjet nozzle includes a first wafer having active drive circuitry together with an ink jet print nozzle formed therein; a second wafer having an ink channel formed therein; and a paddle layer sandwiched between the first and second wafers in a chamber complementarily defined by the wafers. The paddle layer is in signal communication with the active drive circuitry so that ink supplied via the ink channel is ejected via the print nozzle upon actuation of the paddle layer by the circuitry. The first wafer includes a silicon wafer upon which is fabricated an epitaxial boron doped layer, an epitaxial silicon layer, drive transistors and distribution circuitry forming a CMOS logic and drive transistor level, and a silicon nitride layer.

Claims (7)

1. An inkjet nozzle comprising:

a first wafer having active drive circuitry together with an ink jet print nozzle formed therein;

a second wafer having an ink channel formed therein; and

a paddle layer sandwiched between the first and second wafers in a chamber complementarily defined by the wafers, the paddle layer in signal communication with the active drive circuitry, so that ink supplied via the ink channel is ejected via the print nozzle upon actuation of the paddle layer by the circuitry, wherein

the first wafer includes a silicon wafer upon which is fabricated an epitaxial boron doped layer, an epitaxial silicon layer, and a drive transistors and distribution circuitry forming a CMOS logic and drive transistor level.

2. The inkjet nozzle of claim 1 , wherein the paddle layer includes two solenoid coil paddles arranged on top of each other, said coil paddles thermally expanding upon activation by the drive circuitry to eject the ink.

3. The inkjet nozzle of claim 2 , wherein the paddle layer is constructed utilizing a damascene process utilizing chemical mechanical polishing techniques.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2013
From: SILVERBROOK RESEARCH PTY. LIMITED
To: ZAMTEC LIMITED
Reel/Frame 031517/0134 →