Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particle
There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle ( 2 ) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film ( 3 ) formed by welding of fine particles ( 3 a ) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
1. A method for producing a conductive particle comprising:
causing fine particles of an insulating resin to collide with the surface of a base particle to cause adhesion of said fine particles to said surface of said base particle to coat said surface with an insulating resin film,
wherein the insulating resin of said fine particle is selected from the group consisting of a cross-linked acrylic resin, a styrene-acryl copolymer, a divinylbenzene-acryl copolymer, a styrene-divinylbenzene copolymer, a melamine-formaldehyde copolymer, a silicone-acryl copolymer, a polyamide, a polyimide, polybutadiene and NBR,
wherein said surface of said base particle exhibits electrical conductivity, and
wherein the insulating resin film comprises:
an inner insulating resin layer comprising voids towards the base particle, and
an outer shell insulating layer formed continuously and uniformly at an outer surface of the insulating layer by welding of the fine particles.
2. The method for producing a conductive particle according to claim 1 , wherein, in applying said insulating resin film, said fine particles are bonded to the surface of said base particle so that voids will be included between neighboring ones of said fine particles and so that the volume ratio of said voids to the total capacity of said insulating resin film inclusive of said voids is 19.1 to 38.1% based on 100% of said insulating resin film inclusive of said voids.
3. A method for producing a conductive particle comprising:
forming an insulating resin film presenting voids in an initial state by colliding fine particles of an insulating resin to a surface of a base particle exhibiting electrical conductivity at least in a surface thereof; and
continuing the collision of said fine particles until said voids on a surface of said insulating resin film are decreased and said voids towards said base particle are maintained,
wherein the insulating resin film comprises:
an inner insulating resin layer comprising voids towards the base particle, and
an outer shell insulating layer formed continuously and uniformly at an outer surface of the insulating resin layer by welding of the fine particles.