Low-profile loudspeaker driver and enclosure assembly
View Patent ↗A high fidelity, low-profile loudspeaker assembly includes an enclosure having a rear panel which is highly thermally conductive. At least one speaker driver is mounted in the enclosure, the driver including a forwardly facing diaphragm driven by a voice coil former carrying a voice coil, and a rearwardly extending motor structure. An aperture is provided in the rear panel to receiving the driver's motor structure, and a thermally conductive gasket seals the rear panel aperture around cup to provide a thermal path from the driver motor to the rear panel for cooling the driver. On one driver embodiment, a generally dome-shaped annular spider surrounds and supports the voice coil former, the spider being connected at its inner periphery to the approximate vertical midpoint of the voice coil former.
1. A low-profile loudspeaker assembly, comprising:
a loudspeaker enclosure having a front panel and a rear panel;
at least one speaker driver mounted in said enclosure, said driver including a forwardly facing voice coil driven sound radiator and a rearwardly extending motor structure for activating said voice coil;
an aperture in said rear panel receiving said motor structure; and
wherein said loudspeaker assembly enclosure, when mounted on a wall, projects away from the wall's surface by a mounted depth of not more than 1.6 inches, and
wherein said loudspeaker assembly, when mounted on said wall, will play with a measured distortion of not more than 1% at a sound pressure level of at least 100 dB over a frequency range from 170 Hz-20 kHz.
2. The assembly of claim 1 , further including a thermally conductive gasket sealing said aperture around said motor structure and conducting heat from said motor structure.
3. The assembly of claim 2 , further including a driver basket secured to said front panel and supporting said driver in said enclosure.
4. The assembly of claim 3 , wherein said basket includes a support ring engaging said motor structure and said gasket, and wherein said rear panel and said basket are thermally conductive, whereby heat generated in said motor structure is transferred through said support ring and said gasket to said rear panel.
5. The assembly of claim 4 , wherein said enclosure incorporates multiple speaker drivers.
6. The assembly of claim 3 , wherein said voice coil driven sound radiator includes:
a diaphragm secured to said basket;
a cylindrical voice coil former secured at an upper end to an undersurface of said diaphragm and carrying a voice coil at a lower end, whereby activation of said voice coil drives said diaphragm;
a generally upwardly arcuate annular spider surrounding said voice coil former, the spider having an outer periphery secured to said basket and an inner periphery secured to said voice coil former.
7. The assembly of claim 6 , wherein said spider is generally dome-shaped.
8. The assembly of claim 6 , wherein said spider is generally planar, with L-shaped pleats in cross-section.
9. The assembly of claim 6 , wherein said motor includes a cup carrying a permanent magnet and frontplate to provide a magnetic flux circuit for said voice coil, said cup being secured in said basket support ring and extending into said rear panel aperture.
10. A low-profile loudspeaker assembly, comprising:
a loudspeaker enclosure having a front panel and a rear panel, wherein said rear panel is highly thermally conductive;
at least one speaker driver mounted in said enclosure, said driver including:
a forwardly facing diaphragm driven by a voice coil former carrying a voice coil;
a rearwardly extending motor structure having a cup carrying a permanent magnet and frontplate to provide a magnetic flux circuit having a gap for receiving said voice coil;
an aperture in said rear panel receiving said motor structure cup; and
a thermally conductive gasket sealing said aperture around said cup.
11. The low-profile loudspeaker assembly of claim 10 , further including:
a basket secured to said front panel and supporting said driver in said enclosure, said basket including a support ring engaging said motor structure cup and said gasket, said rear panel and said basket being thermally conductive, whereby heat generated in said motor structure is transferred through said support ring and said gasket to said rear panel; and
a generally upwardly arcuate annular spider surrounding said voice coil former, the spider having an outer periphery secured to said basket and an inner periphery secured to said voice coil former.
12. The low-profile loudspeaker assembly of claim 11 , wherein said spider is annular, having an inner and an outer periphery, and is generally dome-shaped, the spider being connected at its outer periphery to said basket and curving upwardly and inwardly for connection at its inner periphery to the approximate vertical midpoint of said voice coil former.
13. The low-profile loudspeaker assembly of claim 11 , wherein said spider is annular, having an inner and an outer periphery, and is generally L-shaped in cross-section, the spider being connected at its outer periphery to said basket and extending upwardly and inwardly for connection at its inner periphery to the approximate vertical midpoint of said voice coil former.
14. The low-profile loudspeaker assembly of claim 11 , wherein said loudspeaker assembly, when mounted on said wall, will play with a measured distortion of not more than 1% and loudly, wherein the said speaker sound pressure level response is at least 100 dB over a frequency range from 170 Hz-20 kHz.
15. The low-profile loudspeaker assembly of claim 11 , wherein said loudspeaker assembly, when mounted on said wall, will play with a measured distortion of not more than 5% and very loudly, wherein the said speaker's sound pressure level response is at least 110 dB over a frequency range from 150 Hz-20 kHz.
16. The low-profile loudspeaker assembly of claim 11 , wherein said loudspeaker enclosure's rear panel is fabricated from a rigid metallic sheet of highly thermally conductive metal.
17. The low-profile loudspeaker assembly of claim 16 , wherein said loudspeaker enclosure's rear panel is fabricated from a rigid metallic sheet of highly thermally conductive aluminum.
18. The low-profile loudspeaker assembly of claim 17 , wherein said loudspeaker enclosure's rear panel is fabricated from a rigid metallic sheet of highly thermally conductive aluminum having a thickness greater than 2 mm.
19. The low-profile loudspeaker assembly of claim 17 , wherein said loudspeaker enclosure's rear panel is fabricated from a rigid metallic sheet of highly thermally conductive aluminum having a thickness of approximately 2.5 mm.
20. A method for fabricating a low-profile loudspeaker assembly, comprising:
providing a loudspeaker enclosure having a front panel and a rear panel, wherein said rear panel is highly thermally conductive;
forming at least one aperture in said rear panel;
mounting at least one speaker driver in said enclosure, said driver including a forwardly facing diaphragm driven by a voice coil former carrying a voice coil, and a rearwardly extending motor structure having a cup carrying a permanent magnet and frontplate to provide a magnetic flux circuit having a gap for receiving said voice coil;
locating said at least one speaker driver in alignment with said at least one aperture in said rear panel so that said cup extends into said aperture; and
providing a thermally conductive gasket in said aperture around said cup to provide thermal contact between said cup and said rear panel.