IP Library Granted Patent US 9,065,177
Granted Patent B2
US 9,065,177 · App. 12/985,300 · Granted Jun 23, 2015

Three-dimensional antenna structure

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Quick Facts
Patent No.
US 9,065,177
App. No.
12/985,300
Granted
Jun 23, 2015
Kind
B2
Abstract

A three-dimensional antenna structure includes first and second antenna components and a via. The first antenna component is on a first layer of a substrate and the second antenna component is on a second layer of a substrate. The via couples the first antenna component to the second antenna component, wherein the first antenna overlaps, from a radial perspective, the second antenna component by an angle of overlap.

Claims (44)

1. A three-dimensional antenna structure comprises:

a first antenna component with a first modified Polya curve pattern on a first layer of a substrate;

a second antenna component with a second modified Polya curve pattern on a second layer of a substrate, wherein at least one of the first and second modified Polya curve patterns comprises a modified Polya curve with constant width and shaping factor, but varying order; and

a via coupling the first antenna component to the second antenna component, wherein the first antenna component overlaps, from a radial perspective, the second antenna component by an angle of overlap.

2. The three-dimensional antenna structure of claim 1 further comprises:

the first antenna component having a first pattern in a first geometric shape; and

the second antenna component has a second pattern in a second geometric shape.

3. The three-dimensional antenna structure of claim 1 further comprises:

a modification of the angle of overlap to modify operating characteristics of the antenna structure based on physical characteristics of the first and second antenna components and on the angle of overlap.

4. The three-dimensional antenna structure of claim 1 comprises a monopole antenna.

5. The three-dimensional antenna structure of claim 1 comprises a dipole antenna.

6. The three-dimensional antenna structure of claim 1 , wherein the substrate comprises at least one of:

an integrated circuit (IC) die;

an IC package substrate; or

a printed circuit board.

7. The three-dimensional antenna structure of claim 1 further comprises:

a plurality of vias to couple the first antenna component to the second antenna component, wherein the plurality of vias includes the via.

8. The three-dimensional antenna structure of claim 1 further comprises:

the first antenna component including a plurality of the modified Polya curve patterned antenna elements; and

the second antenna component including one or more antenna elements.

9. The three-dimensional antenna structure of claim 1 further comprises:

a third antenna component on a third layer of the substrate; and

a second via to couple the third antenna component to the first or the second antenna component.

10. A method of producing a three-dimensional antenna structure comprises:

forming a first antenna component with a first modified Polya curve pattern on a first layer of a substrate;

forming a second antenna component with a second modified Polya curve pattern on a second layer of a substrate, wherein at least one of the first and second modified Polya curve patterns comprises a modified Polya curve with constant width and shaping factor, but varying order; and

coupling the first antenna component to the second antenna component with at least one via, wherein the first antenna component overlaps, from a radial perspective, the second antenna component by an angle of overlap.

11. The method of claim 10 further comprises:

forming the first antenna component having a first pattern in a first geometric shape; and

forming the second antenna component has a second pattern in a second geometric shape.

12. The method of claim 10 further comprises:

modifying the angle of overlap to modify operating characteristics of the antenna structure based on physical characteristics of the first and second antenna components and on the angle of overlap.

13. The method of claim 10 , wherein the substrate comprises at least one of:

an integrated circuit (IC) die;

an IC package substrate; or

a printed circuit board.

14. The method of claim 10 further comprises:

coupling the first antenna component to the second antenna component with a plurality of vias, wherein the plurality of vias includes the via.

15. The method of claim 10 further comprises:

the first antenna component including a plurality of the modified Polya curve patterned antenna elements; and

the second antenna component including one or more antenna elements.

16. The method of claim 11 , wherein at least one of the first and second geometric shapes comprises an orthogonal triangle.

17. The three-dimensional antenna structure of claim 2 , wherein at least one of the first and second geometric shapes comprises an orthogonal triangle.

18. The three-dimensional antenna structure of claim 2 , wherein at least one of the first and second geometric shapes comprises a triangle with a length-to-area ratio in the range of 4-to-1 to 7-to-1.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 9,385,856 TO 9,385,756 PREVIOUSLY RECORDED AT REEL: 47349 FRAME: 001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 22, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 051144/0648 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE PREVIOUSLY RECORDED ON REEL 047229 FRAME 0408. ASSIGNOR(S) HEREBY CONFIRMS THE THE EFFECTIVE DATE IS 09/05/2018. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047349/0001 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047229/0408 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2011
From: ALEXOPOULOS, NICOLAOS G.; LIU, YUNHONG
To: BROADCOM CORPORATION
Reel/Frame 025590/0686 →