Method of making a modular multichannel microelectrode array
Some embodiments of the invention comprise a customizable multichannel microelectrode array with a modular planar microfabricated electrode array attached to a carrier and a high density of recording and/or stimulation electrode sites disposed thereon. Novel methods of making and using same are also disclosed.
1. A method of making a neuroprobe system, comprising the steps of:
providing a carrier;
providing a flexible planar microelectrode array including:
providing a substrate including a plurality of conductive interconnects disposed on the substrate and disposed between layers of dielectrics;
forming a plurality of electrode sites on the substrate such that at least some electrode sites are in contact with a corresponding interconnect, and
forming a plurality of bond pads, at least some of which are in contact with a respective interconnect;
folding the planar microelectrode array; and
coupling the planar microelectrode array to the carrier.
2. The method of claim 1 , wherein providing a carrier includes providing a carrier with a lumen.
3. The method of claim 2 , wherein providing a carrier with a lumen includes configuring the lumen to carry fluid.
4. The method of claim 2 , further including inserting a stylet into the lumen.
5. The method of claim 2 , further including inserting a wire microelectrode into the lumen.
6. The method of claim 1 , wherein providing a flexible planar microelectrode array includes providing a substrate with a lateral projection having an electrode site disposed thereon.
7. The method of claim 6 , wherein coupling the planar microelectrode array to the carrier includes attaching the lateral projection radially to the carrier.
8. The method of claim 7 , wherein folding the planar microelectrode array includes wrapping the lateral projection of the planar microelectrode array around the carrier.
9. The method of claim 1 , wherein providing a substrate includes providing multiple layers of conductive interconnects, each layer being separated by a dielectric layer.
10. The method of claim 1 , wherein forming a plurality of electrode sites includes opening an aperture in a dielectric layer to form a recess and filling the recess with a first metal.
11. The method of claim 10 , wherein forming a plurality of electrode sites further includes depositing a second metal and patterning the second metal to form at least one electrode site.
12. The method of claim 11 , wherein patterning the second metal includes patterning at least one electrode site such that the electrode site is larger than the aperture.
13. The method of claim 1 , wherein providing a flexible planar microelectrode array includes providing a flexible planar microelectrode array in a serpentine shape.
14. The method of claim 13 , wherein folding the planar microelectrode array includes folding the planar microelectrode array from the serpentine shape into a straight shape.
15. The method of claim 14 , wherein folding the planar microelectrode array includes crimping the planar microelectrode array at one or more fold lines.
16. The method of claim 14 , wherein folding the planar microelectrode array includes folding a first segment of the serpentine shape away from a second segment of the serpentine shape at a first fold line.
17. The method of claim 16 , wherein folding the planar microelectrode array includes folding the first segment of the serpentine shape towards the second segment of the serpentine shape at a second fold line approximately perpendicular to the first fold line, thereby aligning the first and second segments in a straight shape.
18. The method of claim 1 , wherein forming a plurality of electrode sites includes configuring a plurality of electrode sites to operate as a composite electrode site.
19. The method of claim 18 , wherein configuring a plurality of electrode sites to operate as a composite electrode site includes grouping a plurality of electrode sites through connections between electrode sites.
20. The method of claim 1 , wherein coupling the planar microelectrode array to the carrier includes applying an adhesive to the carrier.