Actuating transistor including multi-layer reentrant profile
View Patent ↗A method of actuating a semiconductor device includes providing a transistor. The transistor includes a substrate. A first electrically conductive material layer is positioned on the substrate. A second electrically conductive material layer is in contact with and positioned on the first electrically conductive material layer. A third electrically conductive material layer is in contact with and positioned on the second electrically conductive material layer. The third electrically conductive material layer overhangs the second electrically conductive material layer. An electrically insulating material layer is conformally positioned over the third electrically conductive material layer, the second electrically conductive material layer, the first electrically conductive material layer, and at least a portion of the substrate. A semiconductor material layer conforms to and is in contact with the electrically insulating material layer. A fourth electrically conductive material layer is in contact with the semiconductor material layer. A fifth electrically conductive material layer is in contact with the semiconductor material layer. A voltage is applied between the fourth electrically conductive material layer and the fifth electrically conductive material layer. A voltage is applied to the first electrically conductive material layer to electrically connect the fourth electrically conductive material layer and the fifth electrically conductive material layer.
1. A method of actuating a semiconductor device comprising:
providing a transistor including:
a substrate; and
a gate including:
a first electrically conductive material layer positioned on the substrate,
a second electrically conductive material layer in contact with and positioned on the first electrically conductive material layer,
a third electrically conductive material layer in contact with and positioned on the second electrically conductive material layer, the third electrically conductive material layer overhanging the second electrically conductive material layer, the third electrically conductive material layer being in contact with and positioned on the second electrically conductive material layer and the second electrically conductive material layer being in contact with and positioned on the first electrically conductive material layer such that the third electrically conductive material layer, the second electrically conductive material layer, and the first electrically conductive material layer form a mesa;
an electrically insulating material layer conformally positioned over the third electrically conductive material layer, the second electrically conductive material layer, the first electrically conductive material layer of the gate, and at least a portion of the substrate;
a semiconductor material layer that conforms to and is in contact with the electrically insulating material layer; and
a source/drain electrode including a fourth electrically conductive material layer in contact with the semiconductor material layer, the source/drain electrode being positioned on top of the mesa;
a drain/source electrode including a fifth electrically conductive material layer in contact with the semiconductor material layer, the drain/source electrode not being positioned on top of the mesa;
applying a voltage between the fourth electrically conductive material layer and the fifth electrically conductive material layer; and
applying a voltage to the first electrically conductive material layer to electrically connect the fourth electrically conductive material layer and the fifth electrically conductive material layer.
2. The method of claim 1 , the fourth electrically conductive material layer and the fifth electrically conductive material layer being different portions of the same material layer, wherein applying a voltage between the fourth electrically conductive material layer and the fifth electrically conductive material layer includes applying a voltage to different discontinuous portions of the same material layer.
3. The method of claim 1 , the second electrically conductive material layer having a thickness, the electrically insulating material layer having a thickness, the semiconductor material layer having a thickness, wherein the thickness of the second electrically conductive material layer is greater than two times the sum of the thicknesses of the electrically insulating material layer and the semiconductor material layer.
4. The method of claim 1 , wherein the substrate is flexible.
5. The method of claim 1 , wherein the electrically insulating material layer conforms to the reentrant profile and includes a consistent thickness at least in a region where the reentrant profile and the gate are located.
6. The method of claim 1 , wherein the semiconductor material layer conforms to the reentrant profile and includes a consistent thickness at least in a region where the reentrant profile and the gate are located.
7. The method of claim 6 , wherein the semiconductor material layer includes a consistent thickness in the area between the source/drain electrode and the drain/source electrode.
8. The method of claim 1 , wherein the fourth electrically conductive material layer and the fifth electrically conductive material layer are distinct portions of the same electrically conductive material layer.