IP Library Granted Patent US 8,432,948
Granted Patent B2
US 8,432,948 · App. 12/987,424 · Granted Apr 30, 2013

Semiconductor laser device

Inventors: Masaki Tohyama (Kanagawa-ken, JP); Makoto Okada (Chiba-ken, JP); Osamu Horiuchi (Kanagawa-ken, JP)
Assignee: Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 8,432,948
App. No.
12/987,424
Granted
Apr 30, 2013
Kind
B2
Abstract

According to one embodiment, a semiconductor laser device includes stacked layers and a light output layer. The stacked layers include an active layer. The light output layer is provided in contact with a light output end face of an optical cavity made of the stacked layers. The light output layer includes a dielectric layer having a non-amorphous film, and a conductor portion provided at least one of on a surface of the dielectric layer and inside the dielectric layer.

Claims (47)

1. A semiconductor laser device comprising:

stacked layers including an active layer operable to emit a light beam; and

a light output layer provided in contact with a light output end face of an optical cavity made of the stacked layers, the light output layer including a dielectric layer having a non-amorphous film and a nitrogen-containing film, and a conductor portion provided at least one of on a surface of the dielectric layer and inside the dielectric layer, a thickness of the conductor portion being not less than 1 nm and not more than 20 nm,

the non-amorphous films being provided on a surface of the light output layer, or between the surface of the light output layer and the nitrogen-containing film, and

the light beam being emitted through the conductor portion.

2. The device according to claim 1 , wherein a surface of the dielectric layer in contact with the light output end face is made of the nitrogen-containing film.

3. A semiconductor laser device comprising:

stacked layers including an active layer operable to emit a light beam; and

a light output layer provided in contact with a light output end face of an optical cavity made of the stacked layers, the light output layer including a dielectric layer having a non-amorphous film, and a conductor portion provided at least one of on a surface of the dielectric layer and inside the dielectric layer, a thickness of the conductor portion being not less than 1 nm and not more than 20 nm,

the dielectric layer being provided between the conductor portion and the light output end face and including at least an oxide film, and

the light beam being emitted through the conductor portion.

4. The device according to claim 3 , wherein the oxide film includes at least two oxide layers having different refractive indices laminated in the oxide film.

5. The device according to claim 1 , wherein the conductor portion has catalytic action.

6. The device according to claim 5 , wherein the conductor portion includes at least one of Pt, Pd, Rh, and Ir.

7. The device according to claim 1 , wherein

the conductor portion includes a region dispersed as fine particles, and

the light beam is emitted through the dispersed region.

8. A semiconductor laser device comprising:

stacked layers including an active layer operable to emit a light beam; and

a light output layer provided in contact with a light output end face of an optical cavity made of the stacked layers, the light output layer including a dielectric layer having a photocatalytic film provided on a side opposite to the light output end face and a conductor portion provided on the photocatalytic film so as to expose a part of the photocatalytic film, a thickness of the conductor portion being not less than 1 nm and not more than 20 nm,

the light beam being emitted through the conductor portion.

9. The device according to claim 8 , wherein the dielectric layer further includes an oxide film.

10. The device according to claim 8 , wherein the dielectric layer further includes a nitrogen-containing film.

11. The device according to claim 10 , wherein a surface of the dielectric layer in contact with the light output end face is made of the nitrogen-containing film.

12. The device according to claim 8 , wherein the photocatalytic film is a non-amorphous film.

13. The device according to claim 10 , wherein the dielectric layer includes a non-amorphous film provided on a surface of the light output layer, or between the surface of the light output layer and the nitrogen-containing film.

14. The device according to claim 8 , wherein the conductor portion has catalytic action.

15. The device according to claim 14 , wherein

the conductor portion includes a region dispersed as fine particles, and

the light beam is emitted through the dispersed region.

16. The device according to claim 8 , wherein the photocatalytic film includes at least one of titanium oxide, titanate, and zinc oxide.

17. The device according to claim 1 , further comprising:

a photodetecting element being able to receive a part of a light beam emitted through a light reflecting layer provided on a light reflecting end face opposed to the light output end face,

the light reflecting layer including a reflection-side dielectric layer provided in contact with the light reflecting end face, and a reflection-side conductor portion provided at least one of on a surface of the reflection-side dielectric layer and inside the reflection-side dielectric layer.

18. The device according to claim 1 , further comprising:

a photodetecting element,

the photodetecting element being able to receive a part of a light beam emitted from the active layer through the light output layer.

19. The device according to claim 3 , wherein the conductor portion has catalytic action.

20. The device according to claim 3 , wherein

the conductor portion includes a region dispersed as fine particles, and

a light beam is emitted from the dispersed region.

21. The device according to claim 3 , further comprising:

a photodetecting element being able to receive a part of a light beam emitted through a light reflecting layer provided on a light reflecting end face opposed to the light output end face,

the light reflecting layer including a reflection-side dielectric layer provided in contact with the light reflecting end face, and a reflection-side conductor portion provided at least one of on a surface of the reflection-side dielectric layer and inside the reflection-side dielectric layer.

22. The device according to claim 3 , further comprising:

a photodetecting element,

the photodetecting element being able to receive a part of a light beam emitted from the active layer through the light output layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2011
From: TOHYAMA, MASAKI; OKADA, MAKOTO; HORIUCHI, OSAMU
To: HAMAOKA TOSHIBA ELECTRONICS CORPORATION
Reel/Frame 026059/0468 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2011
From: HAMAOKA TOSHIBA ELECTRONICS CORPORATION
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 026059/0482 →
Priority Claims (2)
JP 2008-180655 · Jul 10, 2008 · national
JP 2008-274246 · Oct 24, 2008 · national
Continuity (2)
Continuation PCTJP2009062451 · Jul 8, 2009
Related Publication 20110164643A1 · Jul 7, 2011