Thermally conductive silicone composition and electronic device

1. A thermally conductive silicone composition comprising:

(A) 100 parts by mass of a dimethylpolysiloxane capped at both molecular terminals with dimethylvinylsiloxy groups having a viscosity of from 2,000 to 10,000 mPa·s at 25° C.;

(B) 400 to 3,500 parts by mass of a thermally conductive filler;

(C) 0.1 to 10 parts by mass of a fine silica powder;

(D) an organopolysiloxane represented by the general formula given below and having a viscosity of less than 500 mPa·s at 25° C.:

R 1 3 SiO(R 1 2 SiO) m (R 1 R 3 SiO) n R 1 2 Si—X—SiR 1 (3-a) (OR 2 ) a

wherein X represents an oxygen atom or a bivalent hydrocarbon group having 2 to 10 carbon atoms; R 1 represents identical or different monovalent hydrocarbon groups which are free of unsaturated aliphatic bonds; R 2 represents groups selected from alkyl groups, alkoxyalkyl groups, alkenyl groups, or acyl groups; R 3 is represented by the following general formula: —X—SiR 1 (3-b) (OR 2 ) b , wherein X, R 1 , and R 2 are the same as defined above; and “b” is an integer ranging from 1 to 3; “a” is an integer ranging from 0 to 3; “m” is an integer equal to or greater than 0; and “n” is an integer equal to or greater than 0; however, when “a” is equal to 0, “n” is an integer equal to or greater than 1, wherein component (D) is used in an amount of 0.005 to 10 parts by mass per 100 parts by mass of component (B); and

(E) a silane compound of the following general formula:

R 4 (4-c) Si(OR 2 ) c

wherein R 4 is a monovalent hydrocarbon group; R 2 is the same as defined above; and “c” is an integer ranging from 1 to 3, wherein component (E) is used in an amount of 0.005 to 10 parts by mass per 100 parts by mass of component (B).

2. The thermally conductive silicone composition according to claim 1 , wherein component (B) is a thermally conductive filler selected from a metal oxide, metal hydroxide, nitride, carbide, graphite, metal, or a mixture thereof.

3. The thermally conductive silicone composition according to claim 1 , wherein component (B) is a thermally conductive filler of at least one type selected from the group consisting of aluminum oxide, zinc oxide, magnesium oxide, titanium oxide, beryllium oxide, aluminum hydroxide, and magnesium hydroxide.

4. The thermally conductive silicone composition according to claim 1 , wherein component (B) is surface-treated with components (D) and (E) in component (A).

5. An electronic device comprising a heat-dissipating member, and electronic parts or circuit boards which support the electronic parts, wherein the heat-dissipating member is attached to the electronic parts or to the circuit boards through a thermally conductive silicone composition as claimed in claim 1 .

6. The thermally conductive silicone composition according to claim 1 , wherein component (A) contains silicon-bonded groups selected from alkyl groups, alkenyl groups and aryl groups.

7. The thermally conductive silicone composition according to claim 1 , wherein component (B) is present in 500 to 2,500 parts by mass, and component (C) is present in 0.5 to 10 parts by mass.

8. The thermally conductive silicone composition according to claim 1 wherein component (D) has a viscosity of less than 300 mPa·s at 25° C.

9. The thermally conductive silicone composition according to claim 1 , wherein component (D) is present in 0.1 to 10 parts by mass, and component (E) is present in 0.01 to 10 parts by mass.

10. The thermally conductive silicone composition according to claim 1 , wherein component (D) is selected from the group of:

a dimethylpolysiloxane of the following formula:

a dimethylpolysiloxane of the following formula:

a dimethylpolysiloxane of the following formula:

a dimethylpolysiloxane of the following formula:

a dimethylpolysiloxane of the following formula:

a dimethylpolysiloxane of the following formula:

a dimethylpolysiloxane of the following formula:

a copolymer of a dimethylsiloxane and a methylphenylsiloxane of the following formula:

a copolymer of a dimethylsiloxane and a diphenylsiloxane of the following formula:

a dimethyl polysiloxane of the following formula:

a dimethyl polysiloxane of the following formula:

a dimethyl polysiloxane of the following formula:

or

and a dimethyl polysiloxane of the following formula:

11. The thermally conductive silicone composition according to claim 1 , wherein component (E) is methyl trimethoxysilane.

12. A thermally conductive silicone composition comprising:

(A) 100 parts by mass of an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.;

(B) 400 to 3,500 parts by mass of a thermally conductive filler;

(C) 0.1 to 10 parts by mass of a fine silica powder;

(D) an organopolysiloxane represented by the general formula given below and having a viscosity of less than 500 mPa·s at 25° C.:

R 1 3 SiO(R 1 2 SiO) m (R 1 R 3 SiO) n R 1 2 Si—X—SiR 1 (3-a) (OR 2 ) a

wherein X represents an oxygen atom or a bivalent hydrocarbon group having 2 to 10 carbon atoms; R 1 represents identical or different monovalent hydrocarbon groups which are free of unsaturated aliphatic bonds; R 2 represents groups selected from alkyl groups, alkoxyalkyl groups, alkenyl groups, or acyl groups; R 3 is represented by the following general formula: —X—SiR 1 (3-b) (OR 2 ) b , wherein X, R 1 , and R 2 are the same as defined above; and “b” is an integer ranging from 1 to 3; “a” is an integer ranging from 0 to 3; “m” is an integer equal to or greater than 0; and “n” is an integer equal to or greater than 0; however, when “a” is equal to 0, “n” is an integer equal to or greater than 1, wherein component (D) is used in an amount of 0.005 to 10 parts by mass per 100 parts by mass of component (B); and

(E) a silane compound of the following general formula:

R 4 (4-c) Si(OR 2 ) c

wherein R 4 is a group selected from an epoxycyclohexylalkyl group, a methacryl-containing organic group, or an acryl-containing organic group; R 2 is the same as defined above; and “c” is an integer ranging from 1 to 3, wherein component (E) is used in an amount of 0.005 to 10 parts by mass per 100 parts by mass of component (B).