Integrated Circuit Comprising Light Absorbing Adhesive
The invention relates to a structure 20 comprising a substrate 12, a chip 16 bonded to the substrate by means of a bonding adhesive, wherein the bonding adhesive comprises light absorbing and/or light reflecting particles for protecting the chip from the ambient light. The adhesive may be used to fill all cavities 13 a, 13 b, 13 c between the chip 16 and the substrate 12. The invention further relates to a display and an electronic apparatus comprising said structure.
1 . A structure comprising:
a substrate;
a chip bonded to the substrate by a bonding adhesive,
wherein the bonding adhesive comprises light absorbing and/or light reflecting particles for protecting the chip from ambient light.
2 . The structure according to claim 1 , wherein the chip is arranged on the substrate using at least one bump, the bonding adhesive comprising light absorbing particles arranged in a cavity formed between the chip and the substrate.
3 . The structure according to claim 1 , wherein the bonding adhesive is arranged as a layer having thickness in a range of 10-30 micrometers.
4 . The structure according to claim 1 , wherein a concentration of the light absorbing and/or light reflecting particles in the bonding adhesive comprises at least 50% of a volume of the bonding adhesive.
5 . The structure according to claim 1 , wherein the light absorbing and/or light reflecting particles comprise carbon black particles.
6 . A display comprising a structure according to claim 1 .
7 . The display according to claim 6 , wherein the display is reflective or top-emissive, the bonding adhesive comprises light absorbing particles arranged at areas substantially laterally to the chip, the substrate being opaque to the ambient light.
8 . The display according to claim 8 , further comprising a top light shield.
9 . The display according to claim 6 , wherein the display is flexible.
10 . An electronic apparatus comprising a display according to claim 9 .