Nonvolatile memory element and semiconductor memory device including nonvolatile memory element

1. A nonvolatile memory element comprising:

a current controlling element having a non-linear current-voltage characteristic;

a resistance variable element which changes reversibly between a low-resistance state and a high-resistance state in which a resistance value of the resistance variable element is higher than a resistance value of the resistance variable element in the low-resistance state, in response to voltage pulses applied; and

a fuse,

the current controlling element, the resistance variable element and the fuse being connected in series, and

the fuse being configured to be blown when the current controlling element is substantially short-circuited.

2. The nonvolatile memory element according to claim 1 , wherein the current controlling element, the resistance variable element and the fuse are connected in series to each other at a three-dimensional cross-point at which a first wire crosses a second wire, to constitute a cross-point nonvolatile memory element.

3. The nonvolatile memory element according to claim 1 , wherein the fuse has a resistance value lower than the resistance value of the resistance variable element in the low-resistance state.

4. The nonvolatile memory element according to claim 3 , wherein the fuse has the resistance value of 5 kΩ or less.

5. The nonvolatile memory element according to claim 1 , wherein the fuse comprises polysilicon.

6. The nonvolatile memory element according to claim 1 , wherein the fuse comprises an element which is blown and fused when a current with a predetermined current value or more flows therethrough.

7. A semiconductor memory device comprising:

a substrate;

a plurality of first wires provided on the substrate to extend in parallel with each other;

a plurality of second wires provided above the plurality of first wires to extend in parallel with each other within a plane parallel to a main surface of the substrate and three-dimensionally cross the plurality of first wires; and

a nonvolatile memory element array including a plurality of nonvolatile memory elements, wherein:

each of the plurality of nonvolatile memory elements comprises:

a current controlling element having a non-linear current-voltage characteristic;

a resistance variable element which changes reversibly between a low-resistance state and a high-resistance state in which a resistance value of the resistance variable element is higher than a resistance value of the resistance variable element in the low-resistance state, in response to voltage pulses applied; and

a fuse, wherein:

the current controlling element, the resistance variable element and the fuse are connected in series, and

the fuse is configured to be blown when the current controlling element is substantially short-circuited, and

the nonvolatile memory elements are provided to respectively correspond to three-dimensional cross-points of the plurality of first wires and the plurality of second wires and to connect the first wires to the second wires, respectively.

8. The semiconductor memory device according to claim 7 , wherein:

the resistance variable element includes a first electrode, a second electrode and a resistance variable layer sandwiched between the first electrode and the second electrode,

the current controlling element includes a third electrode, a fourth electrode, and an insulator layer or a semiconductor layer which is sandwiched between the third electrode and the fourth electrode,

the nonvolatile memory element includes at least one of a contact plug provided between the first wire and the first electrode of the resistance variable element to electrically connect the first wire to the first electrode, a contact plug provided between the second electrode of the resistance variable element and the third electrode of the current controlling element to electrically connect the second electrode to the third electrode, and a contact plug provided between the fourth electrode of the current controlling element and the second wire to electrically connect the fourth electrode to the second wire, and

the fuse is configured as one of the contact plugs.

9. The semiconductor memory device according to claim 7 , wherein the fuse comprises an element which is blown and fused when a current with a predetermined current value or more flows therethrough.