Flexible circuit board and method for producing same and bend structure of flexible circuit board
View Patent ↗Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is used with a bend portion provided at least one position of the wiring. The metal foil is made of a metal having a cubic crystal structure, and a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (20 1 0) to (1 20 0) in a rotation direction from (100) to (110) with [001] set as a zone axis. The wiring is formed so that the metal foil is made of a metal having a cubic crystal structure, and that the ridge line in the bend portion has an angle in a range of 2.9° to 87.1° relative to one of fundamental crystal axes <100> in a surface of the metal foil.
1. A method of producing a flexible circuit board including a resin layer and a wiring formed of a metal foil, to be used with a bend portion provided at least at one position of the wiring, the method comprising:
manufacturing a metal-clad laminate having the metal foil and the resin layer,
wherein the metal foil comprises a rolled copper foil having a rolling direction MD aligned with a <100> axis direction of the rolled copper foil, and
wherein I/I 0 ≧25 is satisfied between an intensity (I) of a (200) plane of the rolled copper foil in the thickness direction, which is obtained by X-ray diffraction, and an intensity (I 0 ) of a (200) plane of a copper fine powder which is obtained by X-ray diffraction,
the method further comprising forming a linear wiring so as to have an angle in a range of 26.6° to 63.4° relative to the rolling direction MD of the copper foil so that a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (210) to (120) in a rotation direction from (100) to (110) with [001] set as a zone axis;
wherein the forming of the linear wiring comprises performing thermal treatment on a rolled copper foil having a face-centered cubic structure to exhibit a cubic texture;
wherein the cubic crystal exhibits a preferred orientation in which an occupied area ratio of a region in which one of fundamental crystal axes <100> of a unit lattice of the face-centered cubic structure is located within an orientation difference of 10° relative to a thickness direction of the metal foil is equal to or larger than 50%, and exhibits a preferred orientation in which an occupied area ratio of a region in which another one of the fundamental crystal axes <100> of a unit lattice of the face-centered cubic structure is located within an orientation difference of 10° relative to a direction in a foil surface is equal to or larger than 50%.
2. The method of producing a flexible circuit board according to claim 1 , wherein the bend portion is formed with a repeated operation selected from the group consisting of sliding bending, fold bending, hinge bending, and slide bending.
3. The method of producing a flexible circuit board according to claim 1 , wherein the forming comprises forming the wiring along a direction orthogonal to the ridge line at the bend portion.
4. The method of producing a flexible circuit board according to claim 1 , wherein I/I 0 >33 is satisfied between an intensity (I) of a (200) plane of the rolled copper foil in the thickness direction, which is obtained by X-ray diffraction, and an intensity (I 0 ) of a (200) plane of a copper fine powder which is obtained by X-ray diffraction.