IP Library Granted Patent US 8,966,975
Granted Patent B2
US 8,966,975 · App. 13/002,696 · Granted Mar 3, 2015

Method and apparatus for packaging crash sensors

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Quick Facts
Patent No.
US 8,966,975
App. No.
13/002,696
Granted
Mar 3, 2015
Kind
B2
Abstract

A crash sensor assembly including a printed circuit board and a crash sensor mounted on the printed circuit board, At least one connector pin is mounted to the printed circuit board so as to permit external electrical communication with the crash sensor. A first insert molded soft inner layer of material partially covers the printed circuit board and covers the crash sensor, and a second overmolded hard outer layer of material covers the first soft inner layer of material and bonded thereto and rigidly contacts the printed circuit board.

Claims (26)

1. A crash sensor assembly comprising:

a printed circuit board;

a crash sensor mounted on the printed circuit board;

at least one connector pin mounted to the printed circuit board so as to permit external electrical communication with the crash sensor;

a first insert molded soft inner layer of material only partially covering the printed circuit board and covering the crash sensor to protect the crash sensor from moisture exposure; and

a second overmolded hard outer layer of material covering the first soft inner layer of material and bonded thereto and rigidly contacting the printed circuit board so as to permit transmission of a crash impact pulse to the crash sensor on the printed circuit board and to provide a mounting interface.

2. The crash sensor of claim 1 in which the soft inner layer of material is a thermoplastic elastomer.

3. The crash sensor of claim 1 in which the hard outer layer of material is a polybutylene terephthalate.

4. A crash sensor assembly comprising:

a printed circuit board;

a crash sensor mounted on the printed circuit board;

processing circuitry mounted on the printed circuit board and connected to said crash sensor for processing a signal from the crash sensor;

at least one connector mounted to the printed circuit board so as to permit external electrical communication with the processing circuitry;

a first insert molded soft inner layer of material only partially covering the printed circuit board, and covering the crash sensor, and the processing circuitry to protect the crash sensor and processing circuitry from moisture exposure; and

a second overmolded hard layer of material covering the first inner material and bonded thereto and contacting the printed circuit board so as to permit transmission of a crash impact pulse to the crash sensor on the printed circuit board and to provide a mounting interface.

5. A method for assembling a crash sensor comprising the steps of:

mounting a crash sensor to a printed circuit board;

mounting at least one connector to the printed circuit board so as to permit electrical communication with the crash sensor;

insert molding a soft elastomeric inner layer of material to circuit board so as to only partially cover the printed circuit board and cover the crash sensor to protect the crash sensor from moisture exposure; and

overmolding a hard outer layer of material over the first inner layer material and the printed circuit board so as to permit transmission of a crash impact pulse to the crash sensor on the printed circuit board and to provide a mounting interface.

6. A method for assembling a crash sensor comprising the steps of:

mounting a crash sensor to a printed circuit board;

mounting processing circuitry to the printed circuit board and connecting the processing circuitry to said crash sensor for processing a signal from the crash sensor;

mounting at least one connector to the printed circuit board and connecting the at least one connector to the processing circuitry to permit electrical communication with the processing circuitry;

insert molding a soft elastomeric inner layer of material to circuit board so as to only partially cover the printed circuit board, and cover the crash sensor, and the processing circuitry to protect the crash sensor and processing circuitry from moisture exposure; and

overmolding a hard outer layer of material over the first inner layer of material and the printed circuit board so as to permit transmission of a crash impact pulse to the crash sensor on the printed circuit board and to provide a mounting interface.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 15, 2013
From: JPMORGAN CHASE BANK, N.A.
To: TRW VEHICLE SAFETY SYSTEMS INC.; TRW AUTOMOTIVE U.S. LLC; KELSEY-HAYES COMPANY; TRW INTELLECTUAL PROPERTY CORP.
Reel/Frame 031645/0697 →
SECURITY AGREEMENT Recorded Dec 21, 2012
From: TRW VEHICLE SAFETY SYSTEMS INC.; TRW AUTOMOTIVE U.S. LLC; KELSEY-HAYES COMPANY
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 029529/0534 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2011
From: CAMPBELL, CURT DOUGLAS; MURRAY, JR., NEIL GORDON; PARKER, DION
To: TRW AUTOMOTIVE U.S. LLC
Reel/Frame 026052/0474 →