Photosensitive letterpress printing original plate
The present invention provides a photosensitive letterpress printing original plate provided with a heat sensitive mask layer having high light blocking effect and durability yet prepared as a thin film. A photosensitive letterpress printing original plate including at least (A) a supporting member, (B) a photosensitive resin layer, and (C) a heat sensitive mask layer that are successively laminated, wherein the heat sensitive mask layer (C) contains carbon black and, as a dispersion binder therefor, a butyral resin as well as polyamide containing polar group selected from the group consisting of polyamide containing a tertiary amine group, polyamide containing a quaternary ammonium salt group, polyamide containing an ether group and polyamide containing a sulfonic group.
1. A photosensitive letterpress printing original plate including at least (A) a supporting member, (B) a photosensitive resin layer, and (C) a heat sensitive mask layer that are successively laminated,
wherein the heat sensitive mask layer (C) contains carbon black and a dispersion binder, and the dispersion binder comprises a butyral resin and a polyamide containing a polar group selected from the group consisting of polyamide containing a tertiary amine group, a polyamide containing a quaternary ammonium salt group, polyamide containing an ether group and polyamide containing a sulfonic group.
2. The photosensitive letterpress printing original plate according to claim 1 , wherein the butyral resin and the polyamide containing polar group have a weight ratio in a range from 20 to 80:20 to 80.
3. The photosensitive letterpress printing original plate according to claim 1 or 2 , where the carbon black and dispersion binder have a weight ratio in a range from 25 to 50:20 to 75.
4. The photosensitive letterpress printing original plate of claim 1 , wherein the heat sensitive mask layer has an optical density of at least 2.
5. The photosensitive letterpress printing original plate of claim 1 , wherein the heat sensitive mask layer has a thickness of 0.5 to 2.5 μm.