Multiple magneto meters using Lorentz force for integrated systems
A plurality of integrated electronic compasses and circuit system. The system includes a semiconductor substrate and one or more CMOS integrated circuits formed on one or more portions of the semiconductor substrate. The system has a plurality of electronic compass devices operably coupled to the one or more CMOS integrated circuits. The plurality of electronic compass devices can be integrated with one or more sensors, MEMS, or other devices.
1. An integrated electronic compass and circuit system comprising:
a semiconductor substrate;
one or more CMOS integrated circuits formed on one or more portions of the semiconductor substrate; and
a plurality of electronic compass devices operably coupled to the one or more CMOS integrated circuits.
2. The system of claim 1 further comprising an accelerometer device integrated with the one or more CMOS integrated circuits and the electronic compass devices.
3. The system of claim 1 wherein each of the electronic compass devices comprises one or more moving plates operably coupled between at least a pair of electrodes, the one or more moving plates being configured with an oscillating current signal, the one or more moving plates being subjected to an external magnetic field to cause output of a capacitance measurement between the pair of electrodes.
4. The system of claim 3 wherein the external magnetic field causes the one or more moving plates to defect in a direction perpendicular to the magnetic field and the oscillating current signal.
5. The system of claim 1 wherein each of the electronic compass devices is a micro-mechanical electrical system.
6. The system of claim 1 wherein each of the electronic compass devices comprises a micro-mechanical electronic system coupled to one or more amplifier devices.
7. The system of claim 1 wherein each of the electronic compass devices comprises a movable plate for outputting a reference current, the reference current being provided to one or more sensing devices.
8. The system of claim 1 wherein each of the electronic compass devices comprises a movable plate for outputting a reference current, the reference current being provided to one or more sensing devices, the one or more sensing devices being coupled to one or more amplifiers device configured to output one or more DC signals.
9. An electronic compass comprising:
a plurality of electronic compass devices configured in a linear arrangement, each of the electronic compass devices comprising:
a movable plate;
a first sensing plate coupled to the movable plate; and
a second sensing plate coupled to the movable plate; and
a hub region coupled to each of the electronic compass devices.
10. The system of claim 9 further comprising an accelerometer device integrated with the one or more CMOS integrated circuits and the electronic compass devices.
11. The system of claim 9 wherein the movable plate is configured with an oscillating current signal, the movable plate being subjected to an external magnetic field to cause output of a capacitance measurement between the first sensing plate and the second sensing plate.
12. The system of claim 11 wherein the external magnetic field causes the movable plate to defect in a direction perpendicular to the magnetic field and the oscillating current signal.
13. The system of claim 9 wherein each of the electronic compass devices is a micro-mechanical electrical system.
14. The system of claim 9 wherein each of the electronic compass devices comprises a micro-mechanical electronic system coupled to one or more amplifier devices.
15. The system of claim 9 wherein each of the electronic compass devices is configured to output a reference current, the reference current being provided to one or more sensing devices.
16. The system of claim 15 wherein the one or more sensing devices are coupled to one or more amplifiers device configured to output one or more DC signals.
17. A method of fabricating an integrated electronic compass and circuit device comprising:
providing a semiconductor substrate comprising a surface region;
forming one or more CMOS integrated circuits formed on one or more portions of the semiconductor substrate;
forming a thickness of dielectric material overlying the one or more CMOS integrated circuits;
joining a substrate overlying the thickness of dielectric material;
thinning the substrate to a predetermined thickness;
forming one or more material layers overlying the thinned substrate; and
etching the one or more material layers to form a plurality of electronic compass devices, each of the electronic compass devices having one or more electronic compass elements.
18. The method of claim 17 wherein the one or more electronic compass elements comprise one or more movable plates and one or more electrodes.
19. The method of claim 17 further comprising coupling the plurality of electronic compass devices to a hub region.
20. The method of claim 17 further comprising coupling one or more MEMS devices to the one or more CMOS integrated circuits.