IP Library Granted Patent US 8,475,177
Granted Patent B2
US 8,475,177 · App. 13/008,060 · Granted Jul 2, 2013

Backplane cable interconnection

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Quick Facts
Patent No.
US 8,475,177
App. No.
13/008,060
Granted
Jul 2, 2013
Kind
B2
Abstract

A backplane cabling interconnect scheme is provided that includes a wafer based cable termination and an organizer shroud. The shroud complements existing backplane connectors and provides positioning and polarization for the cable terminated wafer. The wafer cable ends can be stacked or arranged in various arrays and are held in place with an integral latch. A permanent latch is provided for high vibration environments.

Claims (44)

1. A backplane cable interconnection comprising:

a shroud for surrounding contacts of a backplane;

cable end modules installed in slots of the shroud, wherein each of the cable end modules includes:

a printed circuit board having contact pads for engaging the contacts of the backplane;

one or more cables having conductors that are coupled to the contact pads; and

an overmold on the printed circuit board that mechanically couples the one or more cables to the printed circuit board; and

holddowns that are mechanically coupled to the shroud to retain the cable end modules in the slots;

wherein the holddowns disable a release feature of the cable end modules that would allow release of the cable end modules from the slot; and

wherein the release feature includes, for each of the cable end modules, a central body, and a pair of arms emanating from the central body.

2. The interconnection of claim 1 , wherein the holddowns are coupled to the shroud by screws that engaged tapped holes in the shroud.

3. The interconnection of claim 1 ,

wherein the arms are able to flex relative to the central body; and

wherein the arms include latch protrusions that engage latch windows in the shroud when the cable end modules are installed in the slots.

4. The interconnection of claim 3 , wherein the holddowns are located between the central bodies of the cable end modules, and the arms of the cable end modules, preventing inward flexing of the arms toward the central body, thereby preventing disengagement of the latch protrusions from the latch windows.

5. The interconnection of claim 4 , wherein the holddowns are metal strips that are curved away from a center of the shroud.

6. The interconnection of claim 3 , wherein the central bodies each include a body protrusion on one side that fits into a corresponding recess on an adjacent of the cable end modules.

7. The interconnection of claim 3 , wherein the arms each include an arm protrusion on one side that engages a corresponding arm recess on an adjacent of the cable end modules.

8. The interconnection of claim 1 ,

wherein the overmold includes a protrusion and a protrusion-receiving recess on opposite sides; and

wherein the protrusion of one of the cable end modules snaps into the protrusion-receiving recess of an adjacent of the cable end modules.

9. The interconnection of claim 1 ,

wherein the shroud includes:

a main body having the slots therein; and

a pair of side brackets at opposite ends of the main body; and

wherein the side brackets keep the main body away from the backplane when the interconnection is installed on the backplane.

10. The interconnection of claim 1 ,

wherein the slots have different thickness on one slot side than on an opposite slot side; and

wherein the overmolds have corresponding different thicknesses on opposite overmold sides where the overmolds are inserted into different thickness slot sides.

11. The interconnection of claim 1 , wherein the printed circuit board has a conductive ground plane on an opposite face from the contacts.

12. The interconnection of claim 11 , wherein the ground plane is in electrical contact with one or more of the contact pads through one or more vias in the printed circuit board that are filled with conductive material.

13. A cable end module comprising:

a printed circuit board having contact pads;

one or more cables having conductors that are coupled to the contact pads; and

an overmold on the printed circuit board that mechanically couples the one or more cables to the printed circuit board;

wherein the overmold includes a protrusion and a protrusion-receiving recess on opposite sides;

wherein the protrusion snaps into the protrusion-receiving recess of an adjacent of an adjacent cable end module;

wherein for each of the cable end modules, the overmold includes a central body and a pair of arms emanating from opposite sides of the central body, wherein the arms are able to flex relative to the central body; and

wherein the arms include latch protrusions for engaging latch windows in a shroud.

14. The cable end module of claim 13 as part of a plurality of cable end modules snapped together.

15. The cable end module of claim 13 , wherein the central bodies each include a body protrusion on one side that fits into a corresponding recess on an adjacent of the cable end modules.

16. The cable end module of claim 13 , wherein the arms each include an arm protrusion on one side that engages a corresponding arm recess on an adjacent of the cable end modules.

17. The cable end module of claim 13 ,

wherein the printed circuit board has a conductive ground plane on an opposite face from the contacts; and

wherein the ground plane is in electrical contact with one or more of the contact pads through one or more vias in the printed circuit board that are filled with conductive material.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Feb 27, 2025
From: ARES CAPITAL CORPORATION
To: PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; JOY SIGNAL TECHNOLOGY, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.
Reel/Frame 070355/0621 →
SECURITY INTEREST Recorded Feb 27, 2025
From: X-MICROWAVE, LLC; TANTALUM PELLET COMPANY, LLC; EVANS CAPACITOR COMPANY, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.; RUBBERCRAFT CORPORATION OF CALIFORNIA, LTD.; SWIFT TEXTILE METALIZING LLC; RMB PRODUCTS; BAL SEAL ENGINEERING, LLC; KAMATICS CORPORATION; BEI PRECISION SYSTEMS & SPACE COMPANY, INC.; PAKTRON LLC; OHMEGA TECHNOLOGIES, LLC; TICER TECHNOLOGIES, LLC; CUSTOM INTERCONNECTS, LLC; SANDERS INDUSTRIES HOLDINGS, INC.; AKROFIRE, LLC; KAMAN AEROSPACE CORPORATION; KAMAN CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 070344/0430 →
SECURITY INTEREST Recorded Nov 2, 2022
From: PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; JOY SIGNAL TECHNOLOGY LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.
To: ARES CAPITAL CORPORATION
Reel/Frame 061638/0115 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2011
From: CROFOOT, LARRY M.; VENALECK, JOHN T.
To: OHIO ASSOCIATED ENTERPRISES, LLC
Reel/Frame 025650/0894 →