LED MODULE AND BACKLIGHT UNIT HAVING THE SAME
There is provided an LED module, including a bar type circuit substrate formed with at least one groove so as to have a reflecting cup; a plurality of LED chips disposed in the groove of the circuit substrate and linearly arranged in a longitudinal direction of the circuit substrate; and a phosphor film spaced apart from the LED chips and disposed on the circuit substrate to cover the entire groove.
1 . An LED module, comprising:
a bar type circuit substrate formed with at least one groove so as to have a reflecting cup;
a plurality of LED chips disposed in the groove of the circuit substrate and linearly arranged in a longitudinal direction of the circuit substrate; and
a phosphor film spaced apart from the LED chips and disposed on the circuit substrate to cover the entire groove.
2 . The LED module of claim 1 , wherein the at least one groove formed in the circuit substrate is a single groove lengthened in a longitudinal direction of the circuit substrate and the plurality of LED chips are arranged in the single groove in a row.
3 . The LED module of claim 1 , wherein the at least one groove formed in the circuit substrate is a plurality of grooves arranged in a longitudinal direction of the circuit substrate and at least one LED chip is disposed in each of the plurality of grooves.
4 . The LED module of claim 1 , wherein the phosphor film is made of a transparent resin containing phosphors.
5 . The LED module of claim 1 , wherein the LED module emits white light by the plurality of LED chips and the phosphor film.
6 . An edge-type backlight unit, comprising:
a light-guide plate; and
an LED module disposed at least one side surface portion of the light-guide plate,
wherein the LED module includes:
a bar type circuit substrate formed with at least one groove so as to have a reflecting cup;
a plurality of LED chips disposed in the groove of the circuit substrate and linearly arranged in a longitudinal direction of the circuit substrate; and
a phosphor film spaced apart from the LED chips and disposed on the circuit substrate to cover the entire groove.
7 . The edge-type backlight unit of claim 6 , wherein the at least one groove formed in the circuit substrate is a single groove lengthened in a longitudinal direction of the circuit substrate and the plurality of LED chips are arranged in the single groove in a row.
8 . The edge-type backlight unit of claim 6 , wherein the at least one groove formed in the circuit substrate is a plurality of grooves arranged in a longitudinal direction of the circuit substrate and at least one LED chip is disposed in each of the plurality of grooves.
9 . An LED module, comprising:
a bar type circuit substrate;
a plurality of LED chips linearly arranged on the circuit substrate in a longitudinal direction of the circuit substrate;
a wavelength converter lengthened in a longitudinal direction of the circuit substrate so as to encapsulate the plurality of LED chips at a time; and
a lens unit lengthened in a longitudinal direction of the circuit substrate so as to cover the wavelength converter and changing the paths of the light emitted from the wavelength converter in a lateral direction.
10 . The LED module of claim 9 , wherein the lens unit has a dome shape in which a groove is extended in a center of an upper portion of the circuit substrate in a longitudinal direction of the circuit substrate.
11 . The LED module of claim 9 , wherein the wavelength converter is made of a transparent resin containing phosphors.
12 . The LED module of claim 9 , wherein the LED module emits white light by the plurality of LED chips and the wavelength converter.
13 . A direct-type backlight unit, comprising:
a bottom plate; and
a plurality of LED modules arranged on the bottom plate having an interval therebetween and each extended along a length of one side of the bottom plate,
wherein each of the LED modules includes:
a bar type circuit substrate lengthwise extended;
a plurality of LED chips linearly arranged on the circuit substrate in a longitudinal direction of the circuit substrate;
a wavelength converter lengthened in a longitudinal direction of the circuit substrate so as to encapsulate the plurality of LED chips at a time; and
a lens unit lengthened in a longitudinal direction of the circuit substrate so as to cover the wavelength converter and changing the paths of the light emitted from the wavelength converter in a lateral direction.
14 . The direct-type backlight unit of claim 13 , wherein the lens unit has a dome shape in which a groove extended in a longitudinal direction of the circuit substrate is formed in a center of an upper portion of the circuit substrate.