IP Library Granted Patent US 8,421,094
Granted Patent B2
US 8,421,094 · App. 13/011,124 · Granted Apr 16, 2013

Light emitting device

Inventors: Shinya Ishizaki (Osaka, JP); Makoto Agatani (Osaka, JP); Tomokazu Nada (Osaka, JP); Toshio Hata (Osaka, JP)
Assignee: Sharp Kabushiki Kaisha
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Quick Facts
Patent No.
US 8,421,094
App. No.
13/011,124
Granted
Apr 16, 2013
Kind
B2
Abstract

A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.

Claims (49)

1. A light emitting device comprising:

a substrate;

a plurality of light emitting elements provided on a primary surface of the substrate;

at least one protective element connected in parallel with the plurality of light emitting element;

a resin frame made of a resin having a low optical transmittance, the resin frame being provided annularly on the primary surface of the substrate so as to surround a mounting area in which the plurality of light emitting elements are provided;

a fluorescent-material-containing resin layer made of a resin containing fluorescent materials, the fluorescent-material-containing resin layer being provided adjacent to an inner side of the resin frame so as to cover the plurality of light emitting elements; and

at least one first light emitting element connection electrode and at least one second light emitting element connection electrode, which are provided on the primary surface of the substrate so as to face each other along a first direction in the primary surface,

the plurality of light emitting elements having such a circuit configuration that at least two series circuit sections, in each of which at least two of the plurality of light emitting elements are connected in series, are connected in parallel between the at least one first light emitting element connection electrode and the at least one second light emitting element connection electrode,

the at least two series circuit sections being aligned along a second direction orthogonal to the first direction in the primary surface, between the at least one first light emitting element connection electrode and, the at least one second light emitting element connection electrode,

the at least two of the plurality of light emitting elements in each of the at least two series circuit sections being aligned along the first direction,

the at least one first light emitting element connection electrode and the at least one second light emitting element connection electrode being disposed below at least one of the resin frame and the fluorescent-material-containing resin layer.

2. The light emitting device as set forth in claim 1 , wherein:

the plurality of light emitting elements are divided into a plurality of groups so that each of the plurality of groups includes a corresponding first light emitting element connection electrode and a corresponding second light emitting element connection electrode,

the plurality of groups are aligned along the second direction,

connection wiring lines are provided on the primary surface of the substrate so as to connect adjoining groups in series, and

each of the at least one protective element is provided for each of the plurality of groups.

3. The light emitting device as set forth in claim 2 , wherein the resin used for forming the resin frame is colored in white or milky white.

4. The light emitting device as set forth in claim 2 , wherein:

adjoining light emitting elements in each of the at least two series circuit sections are wire-bonded to each other such that a cathode electrode of one of the adjoining light emitting elements is directly connected, via a metal wire, to an anode electrode of the other one of the adjoining light emitting elements.

5. The light emitting device as set forth in claim 4 , wherein:

each of the plurality of light emitting elements includes a cathode electrode and an anode electrode, which are provided so as to face each other, and

the plurality of light emitting elements are aligned in a same orientation in which the cathode electrode and the anode electrode of said each of the plurality of light emitting elements face each other along the first direction.

6. The light emitting device as set forth in claim 4 , wherein:

each of the plurality of light emitting elements includes a cathode electrode and an anode electrode, which are provided so as to face each other, and

the plurality of light emitting elements are aligned in a same orientation in which the cathode electrode and the anode electrode of said each of the plurality of light emitting elements face each other along the second direction.

7. The light emitting device as set forth in claim 2 , wherein:

the at least one protective element is at least one thin-film printed resistor each provided partially on the primary surface of the substrate, and

each of the at least one protective element is provided on a periphery of the mounting area and below at least one of the resin frame and the fluorescent-material-containing resin layer so as to be electrically connected to a corresponding first light emitting element connection electrode and a corresponding second light emitting element connection electrode in a corresponding group.

8. The light emitting device as set forth in claim 7 , wherein:

the at least one thin-film printed resistor has a resistance value of 1 MΩ to 10 GΩ.

9. The light emitting device as set forth in claim 2 , wherein the substrate is a ceramic substrate made of ceramic.

10. The light emitting device as set forth in claim 2 , wherein the resin frame has an annular shape when viewed in a plane manner.

11. The light emitting device as set forth in claim 1 , wherein:

the resin used for forming the resin frame is colored in white or milky white.

12. The light emitting device as set forth in claim 1 , wherein:

adjoining light emitting elements in each of the at least two series circuit sections are wire-bonded to each other such that a cathode electrode of one of the adjoining light emitting elements is directly connected, via a metal wire, to an anode electrode of the other one of the adjoining light emitting elements.

13. The light emitting device as set forth in claim 12 , wherein:

each of the plurality of light emitting elements includes a cathode electrode and an anode electrode, which are provided so as to face each other, and

the plurality of light emitting elements are aligned in a same orientation in which the cathode electrode and the anode electrode of said each of the plurality of light emitting elements face each other along the first direction.

14. The light emitting device as set forth in claim 12 , wherein:

each of the plurality of light emitting elements includes a cathode electrode and an anode electrode, which are provided so as to face each other, and

the plurality of light emitting elements are aligned in a same orientation in which the cathode electrode and the anode electrode of said each of the plurality of light emitting elements face each other along the second direction.

15. The light emitting device as set forth in claim 1 , wherein:

the at least one protective element is a thin-film printed resistor provided partially on the primary surface of the substrate, and

the at least one protective element is provided on a periphery of the mounting area and below at least one of the resin frame and the fluorescent-material-containing resin layer so as to be electrically connected to the at least one first light emitting element connection electrode and the at least one second light emitting element connection electrode.

16. The light emitting device as set forth in claim 15 , wherein:

the thin-film printed resistor has a resistance value of 1 MΩ to 10 GΩ.

17. The light emitting device as set forth in claim 1 , wherein the substrate is a ceramic substrate made of ceramic.

18. The light emitting device as set forth in claim wherein the resin frame has an annular shape when viewed in a plane manner.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2020
From: LEDCOMM LLC
To: HEAVY DUTY LIGHTING LLC
Reel/Frame 052016/0880 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2020
From: SHARP KABUSHIKI KAISHA
To: LEDCOMM LLC
Reel/Frame 051639/0812 →
RECORD TO CORRECT ASSIGNEE'S ADDRESS, PREVIOUSLY RECORDED ON APRIL 4, 2011 AT REEL/FRAME (S) 026131/0897-0899 Recorded Sep 20, 2011
From: ISHIZAKI, SHINYA; AGATANI, MAKOTO; NADA, TOMOKAZU; HATA, TOSHIO
To: SHARP KABUSHIKI KAISHA
Reel/Frame 027083/0591 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2011
From: ISHIZAKI, SHINYA; AGATANI, MAKOTO; NADA, TOMOKAZU; HATA, TOSHIO
To: SHARP KABUSHIKI KAISHA
Reel/Frame 026131/0897 →
Priority Claims (1)
JP 2010-012486 · Jan 22, 2010 · national
Continuity (1)
Related Publication 20110180817A1 · Jul 28, 2011