Active antenna array heatsink

1. An electronics assembly, comprising:

a first finned structure having a first support plate and a plurality of substantially vertical first fins extending from a surface of the first support plate;

a first electronics module mounted to an opposite surface of the first support plate;

a second finned structure having a second support plate and a plurality of substantially vertical second fins extending from a surface of the second support plate, wherein the second finned structure is aligned in series in a passive convective air flow direction above the first finned structure and wherein the first support plate is coupled with the second support plate;

a second electronics module mounted to an opposite surface of the second support plate; and,

a horizontal baffle placed in a gap between the first finned structure and the second finned structure.

2. The electronics assembly of claim 1 , wherein the horizontal baffle is positioned relative to the first and second finned structures to block a direct convective air flow path through the first finned structure from entering the second finned structure.

3. The electronics assembly of claim 1 , wherein the first support plate and the second support plate are formed together as an integral structure.

4. The electronics assembly of claim 1 further comprising:

an upper horizontal baffle positioned above the second finned structure, wherein the upper horizontal baffle forms an outlet for the air flow through the second finned structure; and,

a lower horizontal baffle positioned below the first finned structure, wherein the lower horizontal baffle forms an inlet for the air flow through the first finned structure.

5. The electronics assembly of claim 1 , wherein at least one of the first electronics module and the second electronics module further comprises an RF power amplifier circuit and an antenna.

6. The electronics assembly of claim 2 , wherein the first and second fin structures are composed of aluminum.

7. The electronics assembly of claim 2 , wherein the first and second finned structures are formed by a single metal extrusion.

8. A power amplifier and antenna assembly, comprising:

a heat sink comprising a support plate and a plurality of fins extending in a first direction generally corresponding to passive convective air flow and outward from a surface of the support plate in a second direction, wherein the heat sink further comprises a plurality of cross cut channels in which at least a portion of the plurality of fins are removed to form a plurality of gaps in the first direction and provide a plurality of separate fin module zones arranged in series in the first direction between adjacent gaps;

a plurality of baffles each of which is positioned in a respective gap of the plurality of gaps; and,

a plurality of electronic modules thermally coupled to an opposite surface of the support plate, wherein at least one of the plurality electronic modules further comprises an RF amplifier circuit, wherein at least one of the plurality of electronic modules is coupled to an antenna.

9. The power amplifier and antenna assembly of claim 8 , wherein the first direction is generally vertical and each baffle is positioned relative to the adjacent upper and lower fin module zones to create an outlet for air flow passing through a lower fin module zone and an inlet for different air to flow through an adjacent upper fin module zone.

10. The power amplifier and antenna assembly of claim 9 , wherein each baffle is further positioned to substantially block the outlet air flow passing through the lower fin module from entering the adjacent upper fin module zones.

11. The power amplifier and antenna assembly of claim 8 , wherein each electronic module of the plurality of electronic modules is positioned adjacent to a corresponding fin module zone.

12. The power amplifier and antenna assembly of claim 8 , wherein at least one of the fin module zones has a length differing from the other fin module zones.

13. The power amplifier and antenna assembly of claim 8 , wherein the length of each of the gaps is in the range of approximately 45 millimeters to approximately 50 millimeters.

14. The power amplifier and antenna assembly of claim 8 , wherein the plurality of fin module zones further comprises seven fin module zones.

15. The power amplifier and antenna assembly of claim 8 , wherein the length of the heat sink is greater than 1 meter.

16. The power amplifier and antenna assembly of claim 15 , wherein the heat sink receives from the plurality of electronic modules and thermally transfers to surrounding air more than 100 Watts of heat.

17. The power amplifier and antenna assembly of claim 15 , wherein the heat sink receives from the plurality of electronic modules and thermally transfers to surrounding air more than 200 Watts of heat.

18. The power amplifier and antenna assembly of 8 , wherein the heat sink is formed by a single metal extrusion.

19. A method of passive cooling an active antenna array having a plurality of vertically stacked electronic modules and a heat sink having a support plate and a plurality of vertical fins partitioned into a plurality of fin module zones, the method comprising:

receiving thermal energy from the plurality of vertically stacked electronic modules by the support plate of the heat sink;

coupling the thermal energy received in the support plate to corresponding fin module zones arranged in series in a passive convective air flow direction;

coupling the thermal energy received in the corresponding fin module zones to air in contact with the corresponding fin module zones;

receiving ambient air into a lower region of each fin module zone via passive convection; and,

venting heated air at an upper region of each fin module zone employing baffles for deflecting convective flow of heated air.

20. The method of claim 19 further comprising substantially blocking the heated air of a lower fin module from entering an upper adjacent fin module zone employing said baffles.