Systems and methods for pre-heating adjacent bond pads for soldering
View Patent ↗Systems and methods for pre-heating adjacent bond pads for soldering are provided. In one embodiment, the invention relates to a method for soldering adjacent bond pads, the method including directing an ultraviolet light beam onto the bond pads from a first angle relative to the bond pads for a preselected duration, heating a solder, and depositing the solder onto the bond pads from a second angle relative to the bond pads during the preselected duration, wherein the second angle is different from the first angle.
1. A method for soldering adjacent bond pads, the method comprising:
directing an ultraviolet light beam onto the bond pads from a first angle relative to the bond pads for a preselected duration;
heating a solder; and
depositing the solder onto the bond pads from a second angle relative to the bond pads during the preselected duration, wherein the second angle is different from the first angle.
2. The method of claim 1 , further comprising:
directing nitrogen onto the bond pads from a third angle relative to the bond pads during the preselected duration, wherein the third angle is different from the first angle and the second angle.
3. The method of claim 1 :
wherein the ultraviolet light beam is directed using a ultraviolet light source, and
wherein the solder is deposited using a solder dispensing machine comprising a laser for heating the solder.
4. The method of claim 3 , further comprising:
directing nitrogen onto the bond pads from a third angle relative to the bond pads during the preselected duration, wherein the third angle is different from the first angle and the second angle,
wherein the nitrogen is directed onto the bond pads using a nitrogen dispenser.
5. The method of claim 4 , wherein the ultraviolet light source, the solder dispensing machine, and the nitrogen dispenser are each positioned at different locations in proximity to the bond pads.
6. The method of claim 1 , wherein the preselected duration is less than 10 minutes.
7. The method of claim 1 , wherein the adjacent bond pads comprise a slider bond pad and a suspension assembly bond pad.
8. The method of claim 7 , wherein the slider bond and the suspension assembly bond pad are components of a head gimbal assembly of a magnetic storage device.
9. The method of claim 1 , wherein the heating the solder comprises heating the solder with a laser.
10. The method of claim 1 , wherein the depositing the solder onto the bond pads comprises dispensing the solder from a capillary tube of a solder dispensing machine.
11. The method of claim 10 , wherein the heating the solder comprises heating the solder within the capillary tube using a laser.
12. The method of claim 1 , wherein the directing the ultraviolet light beam onto the bond pads comprises directing the ultraviolet light beam onto the bond pads until a temperature of the bond pads is in a range of about 50 to 80 degrees Celsius.
13. The method of claim 1 , wherein the directing the ultraviolet light beam onto the bond pads comprises directing the ultraviolet light beam onto the bond pads until a temperature of the bond pads is in a range of about 50 to 100 degrees Celsius.
14. The method of claim 1 :
wherein the depositing the solder onto the bond pads comprises dispensing the solder from an output of a solder dispensing machine; and
wherein the method further comprises:
directing nitrogen onto the bond pads and onto the output of the solder dispensing machine from a third angle relative to the bond pads during the preselected duration, wherein the third angle is different from the first angle and the second angle.