Semiconductor memory device
View Patent ↗First main bit lines correspond to at least one first memory cell. Second main bit lines correspond to at least one second memory cell. At least one sense amplifier outputs read data according to a difference between a voltage of any one of the first main bit lines and a voltage of any one of the second main bit lines. A voltage supply switching section supplies a predetermined reference voltage to one of the first main bit lines corresponding to one of the second main bit lines in which a current according to a threshold voltage of the at least one second memory cell is generated. A resistance switching section forms electrical connection between a ground node and the one of the second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated with a predetermined resistance value.
1. A semiconductor memory device comprising:
a plurality of first main bit lines corresponding to at least one first memory cell;
a plurality of second main bit lines corresponding to at least one second memory cell;
at least one sense amplifier configured to output read data according to a difference between a voltage of any one of the plurality of first main bit lines and a voltage of any one of the plurality of second main bit lines;
a voltage supply switching section configured to supply a predetermined reference voltage to one of the plurality of first main bit lines corresponding to one of the plurality of second main bit lines in which a current according to a threshold voltage of the at least one second memory cell is generated; and
a resistance switching section configured to form electrical connection between a ground node and the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated with a predetermined resistance value.
2. The semiconductor memory device of claim 1 , wherein
the resistance switching section includes
at least one resistive element coupled to the ground node at one end, and
at least one switch coupled between the other end of the at least one resistive element and the plurality of second main bit lines.
3. The semiconductor memory device of claim 2 , wherein
the at least one resistive element is any one of a MOS transistor, a polysilicon resistor, or a well resistor.
4. The semiconductor memory device of claim 1 , wherein
the resistance switching section include at least one resistance transistor coupled between the ground node and the plurality of second main bit lines, and
the at least one resistance transistor switches between a conduction state allowing a current to pass with a predetermined resistance value and a non-conduction state not allowing a current to pass, in accordance with a gate voltage of the at least one resistance transistor.
5. The semiconductor memory device of claim 1 , wherein
a resistance value of the resistance switching section is variable.
6. The semiconductor memory device of claim 1 , wherein
the resistance switching section forms electrical connection between the ground node and two or more of the plurality of second main bit lines with a common resistance value.
7. The semiconductor memory device of claim 1 , wherein
the resistance switching section individually forms electrical connection between the ground node and two or more of the plurality of second main bit lines with respective resistance values according to the two or more of the plurality of second main bit lines.
8. The semiconductor memory device of claim 1 , wherein
the reference voltage is variable.
9. The semiconductor memory device of claim 1 , wherein
the voltage supply switching section includes a voltage control section configured to control a voltage value of the reference voltage.
10. The semiconductor memory device of claim 9 , wherein
the voltage control section is a resistance dividing circuit.
11. The semiconductor memory device of claim 9 , wherein
the voltage control section is a regulator circuit.
12. The semiconductor memory device of claim 1 , wherein
the reference voltage is supplied from a voltage supply inside the semiconductor memory device.
13. The semiconductor memory device of claim 1 , wherein
the reference voltage is supplied from outside the semiconductor memory device.
14. The semiconductor memory device of claim 1 , further comprising
a delay circuit configured to output a control signal controlling the at least one sense amplifier.
15. The semiconductor memory device of claim 14 , wherein
the delay circuit is an inverter delay circuit including a single-stage inverter or a plurality of cascade-coupled inverters.
16. The semiconductor memory device of claim 14 , wherein
the delay circuit is a microcontroller.
17. The semiconductor memory device of claim 1 , wherein
a current according to a threshold voltage of the at least one first memory cell is generated in each of the plurality of first main bit lines in read operation, and
a current according to a threshold voltage of the at least one second memory cell is generated in each of the plurality of second main bit lines in the read operation and in control of the threshold voltage of the at least one second memory cell corresponding to the second main bit line,
the voltage supply switching section supplies the predetermined reference voltage to one of the plurality of first main bit lines corresponding to the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated in the control of the threshold voltage of the at least one second memory cell, and
the resistance switching section forms electrical connection between the ground node and the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated with the predetermined resistance value in the control of the threshold voltage of the at least one second memory cell.
18. A semiconductor integrated circuit comprising:
a semiconductor memory device including
a plurality of first main bit lines corresponding to at least one first memory cell,
a plurality of second main bit lines corresponding to at least one second memory cell, and
at least one sense amplifier configured to output read data according to a difference between a voltage of any one of the plurality of first main bit lines and a voltage of any one of the plurality of second main bit lines;
a voltage supply switching section configured to supply a predetermined reference voltage to one of the plurality of first main bit lines corresponding to one of the plurality of second main bit lines in which a current according to a threshold voltage of the at least one second memory cell is generated; and
a resistance switching section configured to form electrical connection between a ground node and the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated with a predetermined resistance value.
19. The semiconductor integrated circuit of claim 18 , further comprising
a delay circuit configured to output a control signal controlling the at least one sense amplifier.
20. The semiconductor integrated circuit of claim 18 , wherein
a current according to a threshold voltage of the at least one first memory cell is generated in each of the plurality of first main bit lines in read operation, and
a current according to a threshold voltage of the at least one second memory cell is generated in each of the plurality of second main bit lines in the read operation and in control of the threshold voltage of the at least one second memory cell corresponding to the second main bit line,
the voltage supply switching section supplies the predetermined reference voltage to one of the plurality of first main bit lines corresponding to the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated in the control of the threshold voltage of the at least one second memory cell, and
the resistance switching section forms electrical connection between the ground node and the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated with the predetermined resistance value in the control of the threshold voltage of the at least one second memory cell.
21. An electronic device comprising:
a semiconductor memory device including
a plurality of first main bit lines corresponding to at least one first memory cell,
a plurality of second main bit lines corresponding to at least one second memory cell, and
at least one sense amplifier configured to output read data according to a difference between a voltage of any one of the plurality of first main bit lines and a voltage of any one of the plurality of second main bit lines;
a voltage supply switching section configured to supply a predetermined reference voltage to one of the plurality of first main bit lines corresponding to one of the plurality of second main bit lines in which a current according to a threshold voltage of the at least one second memory cell is generated; and
a resistance switching section configured to form electrical connection between a ground node and the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated with a predetermined resistance value.
22. The electronic device of claim 21 , further comprising
a delay circuit configured to output a control signal controlling the at least one sense amplifier.
23. The electronic device of claim 21 , wherein
a current according to a threshold voltage of the at least one first memory cell is generated in each of the plurality of first main bit lines in read operation, and
a current according to a threshold voltage of the at least one second memory cell is generated in each of the plurality of second main bit lines in the read operation and in control of the threshold voltage of the at least one second memory cell corresponding to the second main bit line,
the voltage supply switching section supplies the predetermined reference voltage to one of the plurality of first main bit lines corresponding to the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated in the control of the threshold voltage of the at least one second memory cell, and
the resistance switching section configured to form electrical connection between a ground node and the one of the plurality of second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated with a predetermined resistance value in the control of the threshold voltage of the at least one second memory cell.