Heat sink mount and assembly
View Patent ↗An assembly for a heat sink having a contact plate with opposing first and second faces, a plurality of fins extending from the first face of the contact plate, and a plurality of gaps between the fins. A retaining device has a first pair of opposing sides and a second pair of opposing sides, the first and second pairs of opposing sides surrounding an opening, the first pair of opposing sides having primary framing members, at least some of the primary framing members having a first end at a respective side and a distal free end, with at least one engagement member positioned proximate the distal free ends. The primary framing members define a receiving space for the heat sink. A metal spring is configured in a closed shape cross-section for engagement with the retaining device. The metal spring has a pair of elongated sides, a pair of truncated sides and heat sink engagement regions. The heat sink engagement regions are positioned against the contact plate when the metal spring is engaged with the retaining device, to urge the contact plate towards the engagement members. The assembly is particularly well suited for use with ball grid array packages to interface electronic components in such packages with the heat sink.
1. A heat sink mount, comprising:
a retaining device comprising a first pair of opposing sides and a second pair of opposing sides, the first and second pairs of opposing sides surrounding an opening defined by inner surfaces of the first and second pairs of opposing sides, the first pair of opposing sides having primary framing members, at least some of the primary framing members having a first end at a respective side and a distal free end, with at least one engagement member positioned proximate the distal free ends, the primary framing members and the opening defining a receiving space for a heat sink having fins and a contact plate, the second pair of opposing sides each having at least two protrusions extending inwardly from a respective inner surface into the opening, each of the protrusions extending partially across the opening and having a distal end;
a metal spring configured in a closed shape cross-section and for interfacing with the retaining device, the metal spring defining a loop comprising a pair of elongated sides, a pair of truncated sides and heat sink engagement regions, the heat sink engagement regions being positioned against the contact plate when the metal spring is interfaced with the retaining device, for urging the contact plate towards the engagement members when the heat sink is contained in the receiving space,
wherein the metal spring is arranged to bound one or more fins such that the one or more fins are positioned inside of the loop and the protrusions are each arranged to respectively extend into a gap between fins of the heat sink to position the distal end between the fins and directly engage with a truncated side of the metal spring as the metal spring is interfaced with the retaining device for urging the contact plate toward the engagement members.
2. The heat sink mount of claim 1 , wherein the second pair of opposing sides has one or more secondary framing members, the primary and secondary framing members defining the receiving space for the heat sink.
3. The heat sink mount of claim 2 , wherein each of the pair of truncated sides is respectively interfaced with the retaining device at two protrusions.
4. The heat sink mount of claim 3 , wherein the heat sink engagement regions comprise a portion of the elongated sides.
5. The heat sink mount of claim 1 , wherein the metal spring is formed of a metal wire having a substantially circular cross section.
6. The heat sink mount of claim 1 , wherein the engagement members comprise a resilient material.
7. The heat sink mount of claim 1 , wherein the primary and secondary framing members comprise a resilient material.
8. The heat sink mount of claim 1 , wherein the engagement members are angled in a direction toward the receiving space.
9. The heat sink mount of claim 1 , wherein the at least one engagement member is configured for releasable attachment within a gap formed between a ball grid array package and a printed circuit board when the ball grid array package is connected to the printed circuit board.
10. A heat sink assembly, comprising:
a heat sink comprising a contact plate having opposing first and second faces, a plurality of fins extending from the first face of the contact plate, and a plurality of gaps between the fins;
a retaining device comprising a first pair of opposing sides and a second pair of opposing sides, the first and second pairs of opposing sides surrounding an opening defined by inner surfaces of the first and second pairs of opposing sides, the first pair of opposing sides having primary framing members, at least some of the primary framing members having a first end at a respective side and a distal free end, with at least one engagement member positioned proximate the distal free ends, the primary framing members and the opening defining a receiving space for the heat sink, the second pair of opposing sides each having at least two protrusions extending inwardly from a respective inner surface into the opening, each of the protrusions extending partially across the opening and having a distal end; and
a metal spring configured in a closed shape cross-section and for engagement with the retaining device, the metal spring defining a loop comprising a pair of elongated sides, a pair of truncated sides and heat sink engagement regions, the heat sink engagement regions being positioned against the contact plate when the metal spring is engaged with the retaining device, to urge the contact plate towards the engagement members,
wherein the metal spring is arranged to bound one or more fins such that the one or more fins are positioned inside of the loop and the protrusions are each arranged to respectively extend into a gap between fins of the heat sink to position the distal end between the fins and directly engage with a truncated side of the metal spring as the metal spring is interfaced with the retaining device for urging the contact plate toward engagement members.
11. The heat sink assembly of claim 10 , wherein the second pair of opposing sides has one or more secondary framing members, the primary and secondary framing members defining the receiving space for the heat sink.
12. The heat sink assembly of claim 11 , wherein each of the truncated sides is respectively engaged with the retaining device at two protrusions.
13. The heat sink assembly of claim 12 , wherein the heat sink engagement regions comprise a portion of the elongated sides.
14. The heat sink assembly of claim 10 , wherein the metal spring is formed of a metal wire having a substantially circular cross section.
15. The heat sink assembly of claim 10 , wherein the engagement members comprise a resilient material.
16. The heat sink assembly of claim 10 , wherein the primary and secondary framing members comprise a resilient material.
17. The heat sink assembly of claim 10 , wherein the engagement members are angled in a direction toward the receiving space.
18. The heat sink assembly of claim 10 , wherein the at least one engagement member is configured for releasable attachment within a gap formed between a ball grid array package and a printed circuit board when the ball grid array package is connected to the printed circuit board.
19. A heat sink mount, comprising:
a retaining device comprising a first pair of opposing sides and a second pair of opposing sides, the first and second pairs of opposing sides surrounding an opening defined by inner surfaces of the first and second pairs of opposing sides, the first pair of opposing sides having primary framing members, at least some of the primary framing members having a first end at a respective side and a distal free end, with at least one engagement member positioned proximate the distal free ends, the primary framing members and the opening defining a receiving space for a heat sink having fins and a contact plate, the second pair of opposing sides each having one or more protrusions extending inwardly from a respective inner surface into the opening, each of the protrusions extending partially across the opening and having a distal end;
a metal spring configured in a closed shape cross-section and for interfacing with the retaining device, the metal spring defining a loop comprising a pair of elongated sides, a pair of truncated sides and heat sink engagement regions, the heat sink engagement regions being positioned against the contact plate when the metal spring is interfaced with the retaining device, for urging the contact plate towards the engagement members when the heat sink is contained in the receiving space,
wherein the metal spring is arranged to bound one or more fins such that the one or more fins are positioned inside of the loop and the protrusions are each arranged to respectively extend into a gap between fins of the heat sink to position the distal end between the fins and directly engage with a truncated side of the metal spring as the metal spring is interfaced with the retaining device for urging the contact plate toward the engagement members.