Method of manufacturing mask for depositing thin film

1. A method of manufacturing a mask for depositing a thin film, the method comprising:

providing a raw material substrate for a deposition mask;

removing a portion of the raw material substrate to form a pattern, wherein a plurality of openings are defined in the pattern; and

irradiating at least a laser beam onto the openings of the pattern at an inclination angle with respect to the raw material substrate such that inclined portions are formed at the side surfaces of each of the openings of the pattern,

wherein the irradiating comprises emitting the laser beam and a water jet together,

and wherein the irradiating comprises adjusting a direction of a water jet nozzle for ejecting the water jet to form the inclination angle between the water jet nozzle and the raw material substrate.

2. The method of claim 1 , wherein the irradiating comprises moving the laser beam along edges of each of the openings of the pattern at the inclination angle so that at least part of the edges of the openings is removed to form the inclined portions.

3. The method of claim 1 , wherein the irradiating further comprises:

ejecting the water jet via the water jet nozzle; and

irradiating the laser beam onto the raw material substrate through the water jet nozzle.

4. The method of claim 1 , further comprising: before the laser beam, emitted from a laser beam source, reaches the water jet nozzle, transmitting the laser beam through at least one lens.

5. The method of claim 1 , wherein the inclination angle is less than about 58°.

6. The method of claim 1 , wherein the inclination angle is in a range of about 10° to about 53°.

7. The method of claim 1 , wherein the pattern comprises:

a plurality of mask pattern portions respectively corresponding to unit devices arranged on a substrate on which a thin film is to be deposited; and

a plurality of ribs separating adjacent mask pattern portions, wherein each of the mask pattern portions comprises i) a plurality of openings having substantially the same pattern as that of a thin film constituting each of the unit devices arranged on the substrate on which the thin film is to be deposited and ii) a plurality of shielding portions defining the openings, wherein each of the shielding portions has inclined portions at side surfaces thereof.

8. The method of claim 7 , wherein each of the ribs has an inclined portion at the side surface thereof, which is at a side of one of the openings.

9. The method of claim 1 , wherein the pattern is formed by wet etching.

10. The method of claim 1 , wherein the pattern is formed by irradiating a laser beam onto the raw material substrate to remove portions of the raw material substrate.