Three-function reflowable circuit protection device
View Patent ↗A circuit protection device is configured to protect circuit elements under any one of the following three activation conditions: an over current condition, an over temperature condition, and an activation control current received by a heater element. The circuit element includes first and second electrodes, and the heater element. A sliding contact is connected by a sensing element to the first electrode, second electrode, and heater element, thereby bridging and providing a conductive path between each. A spring element is held in tension by, and exerts a force against, the sliding contact. Upon detection of any one of three activation conditions, the sensing element releases the sliding contact and the force exerted by the spring element moves the sliding contact to another location on the substrate at which the sliding contact no longer provides a conductive path between the first electrode, second electrode, and heater element.
1. A three-function reflowable circuit protection device comprising:
a substrate comprising a first electrode, a second electrode, and a heater element, the heater element receiving an activation control current;
a sliding contact positioned on the substrate at a first location and having a cantilevered portion extending into an opening in the substrate for restricting movement of the sliding contact to a linear path, wherein at the first location the sliding contact is connected to, and provides a conductive path between, the first electrode, second electrode, and the heater element via a sensing element;
a spring element biasing the sliding contact along the linear path to a second location upon loss of resilience of the sensing element, wherein at the second location the sliding contact does not provide a conductive path between any of the first electrode, second electrode, and the heater element, and
a restraining element securing the sliding contact at the first location during a reflow process,
wherein the sensing element loses resilience upon detection of any one of the following activation conditions:
an over current condition;
an over temperature condition; and
the activation control current received by the heater element, and
wherein application of an arming current through the restraining element causes the restraining element to break and place the circuit protection device in an armed state.
2. The circuit protection device of claim 1 , wherein the sensing element comprises a material that melts at a threshold temperature.
3. The circuit protection device of claim 1 , wherein the heater element is one of a thin-film resistor and a positive temperature coefficient device.
4. The circuit protection device of claim 1 , wherein the spring element exerts a force on the cantilever portion.
5. The circuit protection device of claim 4 , wherein when the sensing element loses resilience, the spring element moves the sliding contact to the second location by pushing the cantilever portion.
6. The circuit protection device of claim 4 , wherein when the sensing element loses resilience, the spring element moves the sliding contact to the second location by pulling the cantilever portion.
7. The circuit protection device of claim 1 , wherein the over current condition at which the spring element moves the sliding contact to the second location is detected when a current passing between the first and second electrodes exceeds a threshold current and causes the sensing element to melt.
8. The circuit protection device of claim 1 , wherein the over temperature condition at which the spring element moves the sliding contact to the second location is detected when an ambient temperature surrounding the circuit protection device exceeds a threshold temperature.
9. The circuit protection device of claim 1 , wherein the heater element heats up to a melting point of the sensing element upon receipt of the activation control current.
10. The circuit protection device of claim 1 , wherein the substrate comprises mounting pads allowing surface mounting of the circuit protection device to a panel.
11. A reflowable circuit protection device comprising:
a substrate comprising a first electrode, a second electrode, and a heater element between the first and second electrodes;
a sliding contact positioned on the substrate location and having a cantilevered portion extending into an opening in the substrate for restricting movement of the sliding contact to a linear path, wherein:
at a first location on the substrate the sliding contact provides a conductive path between the first electrode, second electrode, and the heater element,
at a second location on the substrate the sliding contact does not provide a conductive path between any of the first electrode, second electrode, and the heater element;
a spring element biasing the sliding contact to the second location along the linear path upon detection of any one of the following activation conditions:
an over current condition;
an over temperature condition; and
the activation control current received by the heater element, and
a restraining element securing the sliding contact at the first location during a reflow process,
wherein application of an arming current through the restraining element causes the restraining element to break and place the circuit protection device in an armed state.
12. The circuit protection device of claim 11 , further comprising a housing that encases the substrate, sliding contact, and spring element.
13. The circuit protection device of claim 12 , wherein a height of the housing that encases the substrate, sliding contact, and spring element circuit is less than or equal to approximately 1.5 mm.
14. The circuit protection device of claim 12 , wherein a length of the housing that encases the substrate, sliding contact, and spring element is less than or equal to approximately 6.0 mm.
15. The circuit protection device of claim 12 , wherein a width of the housing that encases the substrate, sliding contact, and spring element is less than or equal to approximately 3.8 mm.
16. The circuit protection device of claim 11 , wherein the heater element comprises one of a thin-film resistor and a positive temperature coefficient device.
17. The circuit protection device of claim 11 , wherein the substrate comprises mounting pads allowing surface mounting of the circuit protection device to a panel.
18. A reflowable circuit protection device comprising:
a substrate comprising a first electrode, a second electrode, and a heater element, the heater element receiving an activation control current;
a sliding contact positioned on the substrate location and having a cantilevered portion extending into an opening in the substrate for restricting movement of the sliding contact to a linear path, wherein:
at a first location on the substrate the sliding contact provides a conductive path between the first electrode, second electrode, and heater element, and
at a second location on the substrate the sliding contact does not provide a conductive path between any of the first electrode, second electrode, and heater element; and
a spring element exerting on the sliding contact a force directed along the linear path,
wherein at the first location the sliding contact resists the force exerted by the spring element until detection of any one of the following activation conditions:
an over current condition;
an over temperature condition; and
the activation control current received by the heater element, and
wherein upon detection of any one of the activation conditions, the force exerted by the spring element moves the sliding contact to the second location, and
a restraining element securing the sliding contact at the first location during a reflow process,
wherein application of an arming current through the restraining element causes the restraining element to break and place the circuit protection device in an armed state.
19. The circuit protection device of claim 18 , wherein the over current condition at which the spring element moves the sliding contact to the second location is detected when a current passing between the first and second electrodes exceeds a threshold current and causes the sensing element to melt.
20. The circuit protection device of claim 18 , wherein the over temperature condition at which the spring element moves the sliding contact to the second location is detected when an ambient temperature surrounding the circuit protection device exceeds a threshold temperature.