METHODS OF BONDING SUPERABRASIVE PARTICLES IN AN ORGANIC MATRIX
Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle.
1 . A method of improving superabrasive particle retention in a CMP pad dresser having a plurality of superabrasive particles held in a solidified organic material layer with a portion thereof protruding out of the solidified organic material layer for contact with and dressing of a CMP pad, comprising:
securing the plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to dress a CMP pad.
2 . The method of claim 1 , wherein the arrangement of the plurality of superabrasive particles is configured to uniformly distribute drag forces across substantially each superabrasive particle.
3 . The method of claim 1 , wherein a majority of the plurality of superabrasive particles protrudes to a predetermined height above the solidified organic material layer.
4 . The method of claim 3 , wherein the predetermined height produces a cutting depth of less than about 20 microns when used to dress the CMP pad.
5 . The method of claim 3 , wherein the superabrasive particles protrude to a predetermined height that is along a designated profile.
6 . The method of claim 5 , wherein the designated profile is a plane.
7 . The method of claim 6 , wherein the plane has a slope.
8 . The method of claim 6 , wherein the plane has a curved shape.
9 . The method of claim 8 , wherein the curved shape is a dome shape.
10 . The method of claim 5 , wherein a majority of the plurality of superabrasive particles are arranged such that their tips vary from the designated profile to less than about 10% of the average size of the superabrasive particles.
11 . The method of claim 3 , wherein a majority of the plurality of superabrasive particles are arranged such that their tips protrude to less than about 40 microns.
12 . The method of claim 1 , wherein the plurality of superabrasive particles are of substantially the same size.
13 . The method of claim 1 , wherein securing the plurality of superabrasive particles includes arranging the plurality of superabrasive particles according to a predetermined attitude.
14 . The method of claim 13 , wherein the predetermined attitude is a uniform attitude across substantially all of the plurality of superabrasive particles.
15 . The method of claim 13 , wherein the plurality of superabrasive particles are substantially configured with an apex portion oriented towards a work piece.
16 . The method of claim 1 , wherein the plurality of superabrasive particles are evenly spaced at a distance of from about 3 times to about 5 times the average size of the superabrasive particles.
17 . A CMP pad dresser comprising:
a substrate;
a solidified organic material layer attached to the substrate; and
a plurality of superabrasive particles secured in the solidified organic material layer with a portion thereof protruding out of the organic material layer for the purpose of engaging and dressing a CMP pad, said plurality of superabrasive particles secured in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to dress a CMP pad.
18 . The tool of claim 17 , wherein each of the plurality of superabrasive particles protrudes to a predetermined height above the solidified organic material layer.
19 . The tool of claim 18 , wherein the predetermined height is along a designated profile.
20 . The tool of claim 18 , wherein the designated profile is a plane, a plane with a slope, a plane with a curved shape, or a plane with a dome shape.