MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT
An integrated circuit (IC) device arrangement includes a substrate, an IC die coupled to the substrate, an antenna coupled to the IC die, and a first wirelessly enabled functional block coupled to the IC die. The wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block coupled to the substrate. The antenna is configured to communicate with another antenna coupled to another device.
1 . An integrated circuit (IC) device, comprising:
a substrate;
an IC die coupled to the substrate;
an antenna coupled to the IC die, wherein the antenna is configured to communicate with another antenna coupled to another device; and
a first wirelessly enabled functional block coupled to the IC die, wherein the wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block coupled to the substrate.
2 . The IC device of claim 1 , wherein the antenna comprises at least one of a dipole antenna and a patch antenna.
3 . The IC device of claim 1 , further comprising an antenna plane that includes the antenna.
4 . The IC device of claim 3 , wherein the antenna plane comprises at least one of a capacitor, inductor, coil, and a balun.
5 . The IC device of claim 3 , wherein the antenna plane comprises a metal tape attached to the IC die.
6 . The IC device of claim 3 , wherein the antenna plane comprises an etcheable metal layer coupled to a substrate.
7 . The IC device of claim 1 , wherein the antenna spreads heat from the IC die to the substrate.
8 . The IC device of claim 1 , wherein the antenna is coupled to the substrate.
9 . The IC device of claim 8 , wherein the antenna comprises at least one of a slot antenna and a patch antenna.
10 . The IC device of claim 1 , farther comprising a heat spreader coupled to the IC die and the substrate.
11 . The IC device of claim 10 , wherein the heat spreader comprises a waveguide.
12 . The IC device of claim 1 , wherein the first wirelessly enabled circuit block is coupled to the antenna through a via.
13 . The IC device of claim 1 , further comprising: a second substrate having an insulating layer and an etcheable metal layer, wherein the etcheable metal layer includes the antenna.
14 . The IC device of claim 1 , wherein the first wirelessly enabled circuit block comprises a transceiver.
15 . A method of manufacturing an integrated circuit (IC) device, comprising:
providing an IC die;
forming an antenna on the IC die, wherein the antenna is configured to communicate with another antenna coupled to another device;
forming a first wirelessly enabled functional block on the IC die; and
coupling the IC die to a substrate, wherein the first wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block coupled to the substrate.
16 . The method of claim 15 , wherein forming the antenna comprises forming a dipole antenna or forming a patch antenna.
17 . The method of claim 15 , wherein forming the antenna comprises forming an antenna plane that includes the antenna.
18 . The method of claim 15 , further comprising coupling the antenna to the substrate.
19 . The method of claim 15 , further comprising coupling a heat spreader to the IC die.
20 . An integrated circuit (IC) device, comprising:
an IC die; and
an antenna coupled to the IC die, wherein the antenna is configured to communicate with another antenna coupled to another device.