Light emitting device and method of manufacturing the same
Provided is a light emitting device. In one embodiment, a light emitting device includes: a substrate including β-Ga203; a light emitting structure on the substrate, the light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; an electrode on the light emitting structure; and a porous layer at a lateral surface region of the substrate.
1. A light emitting device comprising:
a substrate including β-Ga 2 0 3 ;
a light emitting structure on the substrate, the light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer;
an electrode on the light emitting structure;
a porous layer at a lateral surface region of the substrate; and
a passivation layer in at least the lateral surface region of the light emitting structure,
wherein the porous layer is made of β-Ga 2 0 3 and a crystalline structure of the porous layer is less dense than that of the β-Ga 2 0 3 in the substrate,
wherein a top surface of the porous layer is physically connected to a bottom surface of the passivation layer.
2. The light emitting device of claim 1 , wherein a lateral surface of the substrate is curved, and
wherein a lateral width of a top portion of the substrate is longer than a lateral width of a bottom portion of the substrate,
wherein the light emitting structure is directly disposed on a top portion of the substrate.
3. The light emitting device of claim 1 , wherein the substrate has a thickness in a range of about 1 μm to about 500 μm.
4. The light emitting device of claim 1 , wherein the porous layer includes at least one selected from the group consisting of phosphorus, fluorine, and potassium, wherein the top surface of the porous layer is directly disposed on the bottom surface of the passivation layer.
5. The light emitting device of claim 1 , wherein the substrate includes conductive dopants, wherein the top surface of the porous layer is substantially flush with a top portion of the substrate.
6. The light emitting device of claim 1 , wherein the passivation layer includes at least one selected from the group consisting of SiO 2 , SiO x , and TiO x .
7. The light emitting device of claim 1 , further comprising a buffer layer interposed between the light emitting structure and the substrate.
8. The light emitting device of claim 7 , wherein the buffer layer includes GaN.