Electronic component device and method for manufacturing the same
An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, both of which are composed of a Ni film. A bonding section bonds the first sealing frame to the second sealing frame. For example, a Bi layer is formed on the first sealing frame and an Au layer is formed on the second sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are close contact with each other to form the bonding section. The bonding section is constituted by a mixed layer predominantly composed of a mixed alloy of a Ni—Bi—Au ternary alloy and Au 2 Bi.
1. An electronic component device comprising:
a first member provided with a first Ni film predominantly composed of Ni;
a second member provided with a second Ni film predominantly composed of Ni; and
a bonding section which bonds said first Ni film to said second Ni film, wherein
said bonding section is constituted by a ternary alloy layer predominantly composed of one of a Ni—Bi—Au ternary alloy; and a mixed layer predominantly composed of a mixed alloy of a Ni—Bi—Au ternary alloy and Au 2 Bi.
2. The electronic component device according to claim 1 , wherein
said first member is a main substrate provided with an electronic circuit forming section and a first sealing frame surrounding said electronic circuit forming section on a surface of the main substrate,
said second member is a cover substrate provided with a second sealing frame on a surface of the cover substrate, and
said first sealing frame comprises said first Ni film and said second sealing frame comprises said second Ni film.
3. The electronic component device according to claim 2 , further comprising:
a first connecting electrode on said surface of said main substrate at a location surrounded by said first sealing frame; and
a second connecting electrode on said surface of said cover substrate at a location surrounded by said second sealing frame; and
an electrically connecting section electrically connecting said first connecting electrode to said second connecting electrode, said electrically connecting section having a constitution similar to that of said bonding section.
4. The electronic component device according to claim 2 , wherein a width of the first sealing frame is different than a width of the second sealing frame.
5. The electronic component device according to claim 2 , further comprising a metal film between at least one of (1) the first sealing frame and the main substrate and (2) the second sealing frame and the cover substrate.
6. The electronic component device according to claim 1 , wherein a thickness of the first and second Ni films is set such that a total volume of Ni supplied from the first and second Ni films is 16.5% or more of a volume of a Bi layer used to form the bonding section.
7. The electronic component device according to claim 6 , wherein at least one of the first and second Ni films further includes an Au layer predominantly composed of Au, and wherein a thickness of the Au layer is set such that a total volume of Au supplied from the Au layer is 11.1% or more and 27% or less of the volume of the Bi layer used to form the bonding section.
8. The electronic component device according to claim 1 , wherein at least one of the first and second Ni films further includes an Au layer predominantly composed of Au, and wherein a thickness of the Au layer is set such that a total volume of Au supplied from the Au layer is 27% or more of a volume of a Bi layer used to form the bonding section.
9. The electronic component device according to claim 1 , wherein an average composition ratio of the Ni—Bi—Au ternary alloy is approximately Ni:Bi:Au=11:73:16% by weight.