Integrated circuit packaging system with embedded circuitry and post
View Patent ↗An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant.
1. An integrated circuit packaging system comprising:
an integrated circuit device, the integrated circuit device includes device interconnects;
a conductive post laterally adjacent to the integrated circuit device, the conductive post with a contact surface;
an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant, an active side of the integrated circuit device coplanar with a bottom encapsulant surface of the encapsulant;
a top conductive layer in direct physical contact with the contact surface and the encapsulant, such that the conductive layer is coplanar to the encapsulant for forming a redistribution layer along a horizontal plane; and
a bottom conductive layer in direct contact with a base surface of the conductive post, in direct physical contact with the device interconnects of the integrated circuit device, in direct physical contact with the active surface of the integrated circuit device, and in direct physical contact with a bottom encapsulant surface of the encapsulant.
2. The system as claimed in claim 1 wherein the bottom conductive layer is electrically coupled to the conductive post.
3. The system as claimed in claim 1 wherein the conductive post includes the conductive post having a narrow physical profile.
4. The system as claimed in claim 1 wherein the conductive post includes the conductive post with the base surface coplanar with the active surface of the integrated circuit device.
5. The system as claimed in claim 1 wherein the conductive post includes the conductive post coplanar with a side of the encapsulant opposite to the top encapsulant surface.
6. The system as claimed in claim 1 wherein the integrated circuit device with the active surface mounted adjacent the conductive post.
7. The system as claimed in claim 6 further comprising a top exposed conductor on the top layer.
8. The system as claimed in claim 6 wherein the conductive post includes gold, aluminum, copper, or silver.
9. The system as claimed in claim 6 wherein the conductive post includes the conductive post with a thickness greater than two microns.
10. The system as claimed in claim 6 wherein the conductive post with the contact surface includes the contact surface coplanar with a top encapsulant surface.