IP Library Granted Patent US 8,222,956
Granted Patent B2
US 8,222,956 · App. 13/027,959 · Granted Jul 17, 2012

Amplifying device and signal processing method based on amplifying device

Assignee: Huawei Technologies Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,222,956
App. No.
13/027,959
Granted
Jul 17, 2012
Kind
B2
Abstract

An amplifying device and a signal processing method based on an amplifying device are provided, capable of reducing performance requirements of modules and reducing design difficulty of the modules. The amplifying device includes at least one amplifying module, including two receiving paths, in which a first receiving path is configured to attenuate and amplify an input signal after the input signal is pre-amplified, and a second receiving path is configured to amplify the input signal when the input signal is not pre-amplified. The signal processing method based on the amplifying device is further provided. The amplifying device and the signal processing method may be applied in a communication network system.

Claims (33)

1. An amplifying device, comprising:

at least one amplifying module; and

each of the at least one amplifying module comprises a first receiving path and a second receiving path;

wherein the first receiving path is configured to attenuate and amplify a first input signal after the first input signal is pre-amplified; and

the second receiving path is configured to amplify a second input signal when the second input signal is not pre-amplified.

2. The amplifying device according to claim 1 , further comprising at least one divider, wherein each of the at least one divider is coupled with the each of the at least one amplifying module respectively, and configured to perform interlink connection on a signal output by the each of the at least one amplifying module.

3. The amplifying device according to claim 2 , wherein a divider in the at least one divider comprises a first amplifier (AMP) and a second AMP, configured to perform signal interlink connection, and an input of the first AMP and an input of the second AMP are coupled with an output of an amplifying module in the at least one amplifying module.

4. The amplifying device according to claim 3 , wherein the divider further comprises a buffer for isolating impedance, and an input of the buffer is coupled with the output of the amplifying module, and an output of the buffer is coupled with the input of the first AMP.

5. The amplifying device according to claim 2 , wherein a divider in the at least one divider comprises a first AMP and a second AMP, configured to perform signal interlink connection, an input of the first AMP is coupled with an output of an amplifying module in the at least one amplifying module, and an output of the second AMP is coupled with the input of the first AMP.

6. The amplifying device according to claims, wherein the divider further comprises a buffer for isolating impedance, an input of the buffer is coupled with the output of the amplifying module, and an output of the buffer is coupled with the input of the first AMP.

7. The amplifying device according to claim 1 , further comprising a digital controller, coupled with the first receiving path and the second receiving path, configured to:

control the first receiving path to be opened and the second receiving path to be closed when the first input signal is pre-amplified, and

control the second receiving path to be opened and the first receiving path to be closed when the second input signal is not pre-amplified.

8. The amplifying device according to claim 7 , wherein the amplifying module, the divider, and the digital controller are integrated in a semiconductor chip.

9. The amplifying device according to claim 1 , wherein

the first receiving path comprises a Digital Step Attenuator (DSA) and a first Low Noise Amplifier (LNA);

the second receiving path comprises a second LNA;

an input of the DSA is coupled with an input of the second LNA;

an output of the DSA is coupled with an input of the first LNA; and

an output of the first LNA is coupled with an output of the second LNA.

10. The amplifying device according to claim 9 , wherein

the first LNA is connected in parallel to a switch controlled resistance-capacitance (RC) feedback circuit; and

the second LNA is connected in parallel to another switch controlled RC feedback circuit.

11. The amplifying device according to claim 9 , wherein the output of the first LNA and the output of the second LNA share a load in common.

12. A signal processing method based on an amplifying device, the method comprising:

acquiring a signal;

deciding whether the signal is a pre-amplified signal;

attenuating and amplifying the signal to obtain an output signal if the signal is a pre-amplified signal; and

amplifying the signal without being attenuated to obtain the output signal if the signal is not a pre-amplified signal.

13. The method according to claim 12 , further comprising: dividing the output signal into two signals.

14. The method according to claim 13 , wherein the dividing the output signal into two signals comprises:

amplifying the output signal by two amplifiers (AMPs); and

obtaining each of the two signals from an output of each of the two AMPs.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded Feb 5, 2026
From: HUAWEI TECHNOLOGIES CO., LTD.
To: NOKIA TECHNOLOGIES OY
Reel/Frame 074707/0221 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2011
From: HU, XINRONG; WEI, YUAN; YANG, FAN; ZENG, LINGHAI; WANG, CHEN; LIU, LING
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 025812/0316 →
Priority Claims (1)
CN 2010 1 0113264 · Feb 24, 2010 · national
Continuity (1)
Related Publication 20110204973A1 · Aug 25, 2011