IP Library Granted Patent US 8,889,468
Granted Patent B2
US 8,889,468 · App. 13/030,464 · Granted Nov 18, 2014

Method and structure for thin film tandem photovoltaic cell

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Quick Facts
Patent No.
US 8,889,468
App. No.
13/030,464
Granted
Nov 18, 2014
Kind
B2
Abstract

A tandem photovoltaic cell. The tandem photovoltaic cell includes a bifacial top cell and a bottom cell. The top bifacial cell includes a top first transparent conductive oxide material. A top window material underlies the top first transparent conductive oxide material. A first interface region is disposed between the top window material and the top first transparent conductive oxide material. The first interface region is substantially free from one or more entities from the top first transparent conductive oxide material diffused into the top window material. A top absorber material comprising a copper species, an indium species, and a sulfur species underlies the top window material. A top second transparent conductive oxide material underlies the top absorber material. A second interface region is disposed between the top second transparent conductive oxide material and the top absorber material. The bottom cell includes a bottom first transparent conductive oxide material. A bottom window material underlies the first bottom transparent conductive oxide material. A bottom absorber material underlies the bottom window material. A bottom electrode material underlies the bottom absorber material. The tandem photovoltaic cell further includes a coupling material free from a parasitic junction between the top cell and the bottom cell.

Claims (46)

1. A method for fabricating a tandem photovoltaic cell, comprising:

forming a bifacial top cell, comprising:

providing a top first transparent conductive oxide material;

forming a top window material underlying the top first transparent conductive oxide material;

forming a first interface region between the top window material and the top first transparent conductive oxide material, the first interface region being substantially free from one or more entities from the top first transparent conductive oxide material being diffused into the top window material;

forming a top absorber material underlying the top window material, the top absorber material comprising a copper species, an indium species;

subjecting the top absorber material to a thermal treatment process in a sulfur-containing environment, wherein the thermal treatment process includes a temperature ramp rate ranging from about 10 degrees Celsius/second to about 50 degrees Celsius/second;

forming a top second transparent conductive oxide material underlying the top absorber material;

forming a second interface region between the top second transparent conductive oxide material and the top absorber material, the second interface region being substantially free from one or more entities from the top first transparent conductive oxide material being diffused into the top absorber material, wherein the second interface region comprises at least one material selected from the group consisting of platinum, titanium, chromium, and silver;

forming a bottom cell, comprising:

forming a bottom first transparent conductive oxide material;

forming a bottom window material underlying the first bottom transparent conductive oxide material;

forming a bottom absorber material underlying the bottom window material;

forming a bottom electrode material underlying the bottom absorber material; and

forming a coupling layer between the bifacial top cell and the bottom cell, the coupling layer being free from a parasitic junction between the bifacial top cell and the bottom cell.

2. The method of claim 1 wherein the first transparent conductive oxide comprises indium tin oxide (ITO), aluminum doped zinc oxide (ZnO:Al), or Fluorine doped tin oxide (SnO 2 :F).

3. The method of claim 1 wherein the top window material comprises cadmium sulfide (CdS), zinc sulfide (ZnS), zinc selenium (ZnSe), zinc oxide (ZnO), or zinc magnesium oxide (ZnMgO).

4. The method of claim 1 wherein the top absorber material comprises copper indium disulfide (CIS), copper indium aluminum disulfide, copper indium gallium disulfide (CIGS), or (Ag,Cu)(In,Ga)S2.

5. The method of claim 1 wherein the top second transparent conductive oxide material comprises cadmium sulfide (CdS), zinc sulfide (ZnS), zinc selenium (ZnSe), zinc oxide (ZnO), or zinc magnesium oxide (ZnMgO).

6. The method of claim 1 wherein the bottom first transparent conductive oxide material comprises cadmium sulfide (CdS), zinc sulfide (ZnS), zinc selenium (ZnSe), zinc oxide (ZnO), or zinc magnesium oxide (ZnMgO).

7. The method of claim 1 wherein the bottom window material comprises cadmium sulfide (CdS), zinc sulfide (ZnS), zinc selenium (ZnSe), zinc oxide (ZnO), or zinc magnesium oxide (ZnMgO).

8. The method of claim 1 wherein the bottom electrode material comprises a transparent conductive oxide material or a metal material.

9. The method of claim 1 wherein the bottom absorber material comprises a copper indium disulfide thin film material, a copper indium aluminum disulfide thin film material, or a copper indium gallium disulfide material.

10. The method of claim 1 wherein the bottom absorber material comprises Cu 2 SnS 3 ; Cu(In,Ga)Se 2 ; CuInSe 2 ; or FeSi 2 .

11. The method of claim 1 wherein the coupling layer comprises an optically transparent material.

12. The method of claim 1 wherein the coupling layer comprises ethyl vinyl acetate.

13. A method for fabricating a tandem photovoltaic cell, comprising:

forming a bifacial top cell, comprising:

providing a top first transparent conductive oxide material;

forming a top window material underlying the top first transparent conductive oxide material;

forming a first interface region between the top window material and the top first transparent conductive oxide material;

forming a top absorber material underlying the top window material;

subjecting the top absorber material to a thermal treatment process in a sulfur-containing environment, wherein the thermal treatment process includes a temperature ramp rate ranging from about 10 degrees Celsius/second to about 50 degrees Celsius/second;

forming a top second transparent conductive oxide material underlying the top absorber material;

forming a second interface region between the top second transparent conductive oxide material and the top absorber material, wherein the second interface region comprises at least one material selected from the group consisting of platinum, titanium, chromium, and silver;

forming a bottom cell, comprising:

forming a bottom absorber material underlying the bottom window material;

forming a bottom electrode material underlying the bottom absorber material; and

forming a coupling layer between the bifacial top cell and the bottom cell.

14. The method of claim 13 wherein the top absorber material comprises copper indium disulfide (CIS), copper indium aluminum disulfide, copper indium gallium disulfide (CIGS), or (Ag,Cu)(In,Ga)S2.

15. The method of claim 13 wherein the bottom absorber material comprises a copper indium disulfide thin film material, a copper indium aluminum disulfide thin film material, or a copper indium gallium disulfide material.

16. The method of claim 13 wherein the bottom absorber material comprises Cu 2 SnS 3 ; Cu(In,Ga)Se 2 ; CuInSe 2 ; or FeSi 2 .

17. The method of claim 13 wherein the coupling layer comprises ethyl vinyl acetate.

18. The method of claim 13 wherein the first transparent conductive oxide comprises indium tin oxide (ITO), aluminum doped zinc oxide (ZnO:Al), or Fluorine doped tin oxide (SnO 2 :F).

19. The method of claim 13 wherein the top window material comprises cadmium sulfide (CdS), zinc sulfide (ZnS), zinc selenium (ZnSe), zinc oxide (ZnO), or zinc magnesium oxide (ZnMgO).

20. The method of claim 13 wherein the top second transparent conductive oxide material comprises cadmium sulfide (CdS), zinc sulfide (ZnS), zinc selenium (ZnSe), zinc oxide (ZnO), or zinc magnesium oxide (ZnMgO).

Assignments (3)
CHANGE OF NAME Recorded Feb 21, 2014
From: HETF SOLAR INC.
To: STION CORPORATION
Reel/Frame 032324/0402 →
SECURITY AGREEMENT Recorded Feb 10, 2014
From: DEVELOPMENT SPECIALIST, INC., SOLELY IN ITS CAPACITY AS THE ASSIGNEE FOR THE BENEFIT OF THE CREDITORS OF CM MANUFACTURING, INC. (F/K/A STION CORPORATION), AND CM MANUFACTURING (F/K/A STION CORPORATION)
To: HETF SOLAR INC.
Reel/Frame 032209/0879 →
CHANGE OF NAME Recorded Jan 30, 2014
From: STION CORPORATION
To: CM MANUFACTURING, INC.
Reel/Frame 032144/0774 →