Ball grid array package enhanced with a thermal and electrical connector
View Patent ↗A package is provided. The package includes a substrate having first and second surfaces, a stiffener coupled to the first surface of the substrate, and a thermal connector coupled to the second surface of the substrate that is configured to be coupled to a printed circuit board.
1. A package, comprising:
an IC die;
a substrate having first and second surfaces;
a stiffener having first and second surfaces, wherein the first surface of the stiffener is attached to the first surface of the substrate and wherein the IC die is attached to the second surface of the stiffener;
a wirebond that electrically couples the IC die to the first surface of the substrate; and
a thermal connector attached to the second surface of the substrate and configured to be coupled to a printed circuit board, wherein the thermal connector is electrically coupled to the wirebond through a metal layer of the substrate.
2. The package of claim 1 , wherein the IC die has first and second surfaces and wherein the first surface of the IC die is coupled to the second surface of the stiffener, the package further comprising:
a heat spreader coupled to the second surface of the IC die.
3. The package of claim 2 , wherein the stiffener and the heat spreader have substantially the same thermal expansion coefficient.
4. The package of claim 1 , wherein the IC die is coupled to the second surface of the stiffener with an epoxy.
5. The package of claim 1 , further comprising:
a plurality of solder balls coupled to the second surface of the substrate.
6. The package of claim 5 , wherein the plurality of solder balls is located outside an outer dimensional profile of the IC die.
7. The package of claim 2 , wherein the heat spreader is substantially planar.
8. The package of claim 1 , further comprising:
an encapsulate that encapsulates the substrate and the stiffener.
9. The package of claim 8 , further comprising:
a heat spreader coupled to a surface of the IC die.
10. The package of claim 9 , wherein a surface of the heat spreader is exposed.
11. The package of claim 9 , wherein the encapsulate completely encapsulates the heat spreader.
12. The package of claim 1 , wherein the metal layer comprises a contact plane located on the second surface of the substrate and wherein the contact plane is configured to accommodate the thermal connector.
13. The package of claim 1 , wherein the substrate comprises a thermally conductive via.
14. The package of claim 1 , wherein the thermal connector is substantially planar.
15. The package of claim 1 , wherein the stiffener comprises at least one of aluminum or copper.
16. The package of claim 1 , wherein the thermal connector comprises at least one aluminum or copper.
17. The package of claim 1 , wherein the substrate is an organic or a tape substrate.
18. The package of claim 1 , wherein the thermal connector is electrically coupled to a ground potential.
19. A package, comprising:
an IC die;
a substrate having first and second surfaces;
a stiffener having first and second surfaces, wherein the first surface of the stiffener is attached to the first surface of the substrate and wherein the IC die is attached to the second surface of the stiffener; and
a thermal connector attached to the second surface of the substrate and configured to be coupled to a printed circuit board, wherein the thermal connector is electrically coupled to the IC die through a plurality of thermal vias of the substrate.