IP Library Granted Patent US 8,994,667
Granted Patent B2
US 8,994,667 · App. 13/031,126 · Granted Mar 31, 2015

Electronic device

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Quick Facts
Patent No.
US 8,994,667
App. No.
13/031,126
Granted
Mar 31, 2015
Kind
B2
Abstract

According to one embodiment, an L-shaped printed circuit board is connected to the periphery of a film sensor at a plurality of connection portions. Long holes are each formed in the periphery of a film sensor at the center of a portion of the film sensor located between a corresponding pair of adjacent connection portions.

Claims (27)

1. An electronic device comprising:

a housing;

a circuit board in the housing, equipped with an electronic component;

a film sensor on the circuit board, connected to the circuit board at a plurality of connection portions, the film sensor comprising a plurality of hole portions, each of the hole portions located entirely in a region overlapped by the circuit board of the film sensor between two adjacent connection portions of the plurality of connection portions, respectively, and

a spacer,

wherein the plurality of connection portions are arranged in a first direction, each of the connection portions having a length in a second direction orthogonal to the first direction, and

each of the hole portions is a long hole extending beyond both sides of the connection portions in the second direction,

the film sensor has a rectangular shape, comprising a first side, a second side, a third side and a fourth side;

the circuit board has an L-shape along the first and second sides of the film sensor; and

the spacer has an L-shape along the third and fourth sides of the film sensor to keep the film sensor and the circuit board substantially in parallel when the film sensor is thermally expanded.

2. The electronic device of Claim 1 , wherein each of the hole portions is located in a center of the two adjacent connection portions.

3. The electronic device of Claim 1 , wherein another hole portion identical with the hole portion is located between the two adjacent connection portions.

4. The electronic device of Claim 1 , wherein the film sensor and the circuit board are electrically connected to each other via a conductive adhesive.

5. The electronic device of claim 1 , further comprising a fixing frame which has a frame shape facing the L-shaped circuit board and the L-shaped spacer from an opposite side of the film sensor.

6. A structure comprising:

a circuit board equipped with an electronic component;

a film sensor on the circuit board, connected to the circuit board at a plurality of connection portions, the film sensor comprising a plurality of hole portions, each of the hole portions located entirely in a region overlapped by the circuit board of the film sensor between two adjacent connection portions of the plurality of connection portions, respectively, and

a spacer,

wherein the plurality of connection portions are arranged in a first direction, each of the connection portions having a length in a second direction orthogonal to the first direction,

each of the hole portions is a long hole extending beyond both sides of the connection portions in the direction,

the film sensor has a rectangular shape, comprising a first side, a second side, a third side and a fourth side;

the circuit board has an L-shape along the first and second sides of the film sensor; and

the spacer has an L-shape along the third and fourth sides of the film sensor to keep the film sensor and the circuit board substantially in parallel when the film sensor is thermally expanded.

7. The structure of Claim 6 , wherein each of the hole portions is located in a center of the two adjacent connection portions.

8. The structure of Claim 6 , wherein another hole portion identical with the hole portion is located between the two adjacent connection portions.

9. The structure of Claim 6 , wherein the film sensor and the circuit board are electrically connected to each other via a conductive adhesive.

10. The structure of claim 6 , further comprising a fixing frame which has a frame shape facing the L-shaped circuit board and the L-shaped spacer from an opposite side of the film sensor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2019
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA CLIENT SOLUTIONS CO., LTD.
Reel/Frame 048720/0635 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2015
From: NISHIYAMA, SHIGEKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 035041/0036 →