Fingerprint sensing circuit
Fingerprint sensing circuit packages and methods of making such packages may comprise a first substrate having a top side and a bottom side; the top side comprising a fingerprint image sensing side over which a user's fingerprint is swiped; the bottom side comprising a metal layer forming a fingerprint sensing circuit image sensor structure; and a sensor control circuit housed in a sensor control circuit package mounted on the metal layer. The sensor control circuit may comprise an integrated circuit die contained within the sensor control circuit package. The fingerprint sensing circuit package may also have a second substrate attached to the bottom side of the first substrate having a second substrate bottom side on which is placed connector members connecting the fingerprint sensing circuit package to a device using a fingerprint image generated from the fingerprint sensing circuitry contained in the fingerprint sensing circuitry package.
1. A fingerprint sensing system comprising:
a flexible first substrate having a top side and a bottom side, the flexible first substrate formed of an insulating material;
a metal layer formed on the bottom side of the flexible first substrate, the metal layer formed to comprise a fingerprint sensing system image sensor structure;
the top side of the flexible first substrate comprising a fingerprint image sensing side over which a fingerprint of a user is swiped, whereby the first flexible substrate insulates the finger of the user from the fingerprint sensing system image sensor structure;
a system controller integrated circuit housed in a system controller integrated circuit package mounted on the metal layer remotely positioned from the fingerprint sensing system image sensor structure;
a second substrate attached to the bottom side of the flexible first substrate having a second substrate bottom side including connector members connecting the fingerprint sensing system to a device that utilizes an output of the fingerprint sensing system controller integrated circuit;
wherein the connector members comprise metal contact pads connected to the bottom side of the flexible first substrate through metal contact pads on a top side of the second substrate and intermediate connector studs, wherein the intermediate connector studs pass through the second substrate from the top side of the second substrate to the bottom side of the second substrate;
wherein the second substrate comprises a cavity in which the system controller integrated circuit package is disposed, and wherein the cavity is filled with polymer filler.
2. The fingerprint sensing system of claim 1 further comprising:
the first substrate having a thickness determined by back-lapping the first substrate on the top side of the first substrate.
3. The fingerprint sensing system of claim 1 further comprising:
the top side of the first substrate covered with a protective layer of ink.
4. A fingerprint sensing system comprising:
a flexible first substrate having a top side and a bottom side, the flexible first substrate formed of an insulating material;
a metal layer formed on the bottom side of the flexible first substrate, the metal layer formed to comprise a fingerprint sensing system image sensor structure;
the top side of the flexible first substrate comprising a fingerprint image sensing side over which a fingerprint of a user is swiped, whereby the flexible first substrate insulates the finger of the user from the fingerprint sensing system image sensor structure;
a sensor controller integrated circuit housed in a sensor controller integrated circuit package mounted on the metal layer remotely positioned from the fingerprint sensing system image sensor structure;
a second substrate attached to the bottom side of the flexible first substrate having a bottom side of the second substrate including connector members connecting the fingerprint sensing system to a device using a fingerprint image generated from the fingerprint sensing system;
wherein the connector members comprise metal contact pads connected to the bottom side of the flexible first substrate through metal contact pads on a top side of the second substrate and intermediate connector studs, wherein the intermediate connector studs pass through the second substrate from the top side of the second substrate to the bottom side of the second substrate; and
the second substrate comprising a cutout section therein over the sensor controller integrated circuit package, and sensor controller integrated circuit package the protective material disposed in the cutout section that covers the sensor controller integrated circuit package.
5. The fingerprint sensing system of claim 4 wherein the sensor controller integrated circuit package protective material comprises pre-preg.
6. The fingerprint sensing system of claim 4 further comprising:
the top side covered with a protective layer of ink.
7. A fingerprint sensing system package comprising:
a flexible first substrate having a top side and a bottom side;
a metal layer formed on the bottom side of the flexible first substrate, the metal layer formed to comprise a fingerprint sensing system image sensor structure;
the top side of the flexible first substrate comprising a fingerprint image sensing side over which a fingerprint of a user is swiped, whereby the flexible first substrate insulates the finger of the user from the fingerprint sensing system image sensor structure;
a sensor controller integrated circuit housed in a sensor controller integrated circuit package mounted on the metal layer;
a second substrate attached to the bottom side of the flexible first substrate having a bottom side of the second substrate including connector members connecting the fingerprint sensing system package to a device using a fingerprint image generated from the fingerprint sensor controller integrated circuit contained in the fingerprint sensor controller integrated circuit package;
wherein the connector members comprise metal contact pads connected to the bottom side of the flexible first substrate through metal contact pads on a top side of the second substrate and intermediate connector studs, wherein the intermediate connector studs pass through the second substrate from the top side of the second substrate to the bottom side of the second substrate; and
the second substrate comprising an opening spaced over and surrounding the sensor controller integrated circuit package, a sensor controller integrated circuit protective material disposed in the opening that covers the sensor controller integrated circuit.
8. The fingerprint sensing system package of claim 1 further comprising:
the metal layer having portions removed to form conductive traces of the fingerprint image sensing system image sensor structure.
9. A fingerprint sensing system package comprising:
a flexible first substrate having a top side and a bottom side;
a metal layer formed on the bottom side of the flexible first substrate, the metal layer formed to comprise a fingerprint sensing system image sensor structure;
the top side of the flexible first substrate comprising a fingerprint image sensing side over which a fingerprint of a user is swiped, whereby the flexible first substrate insulates the finger of the user from the fingerprint sensing system image sensor structure;
a second substrate attached to the bottom side of the flexible first substrate having a second substrate bottom side including connector members connecting the fingerprint sensing system to a device that utilizes an output of the fingerprint sensing system controller integrated circuit;
wherein the connector members comprise metal contact pads connected to the bottom side of the flexible first substrate through metal contact pads on a top side of the second substrate and intermediate connector studs, wherein the intermediate connector studs pass through the second substrate from the top side of the second substrate to the bottom side of the second substrate; and
a sensor controller integrated circuit housed in a sensor controller integrated circuit package mounted on the metal layer;
wherein the second substrate comprises a cavity in which the sensor controller integrated circuit package is disposed, and wherein the cavity is filled with polymer filler.
10. The system of claim 1 wherein the connector members comprise a ball grid array.
11. The system of claim 7 wherein the connector members comprise a ball grid array.
12. The fingerprint sensing system package of claim 9 further comprising:
the sensor controller integrated circuit comprising an integrated circuit die contained within the sensor controller integrated circuit package.
13. The fingerprint sensing system package of claim 9 further comprising:
the top side of the flexible first substrate is covered with a protective layer of ink.
14. The system of claim 1 wherein the polymer filler comprises epoxy.
15. The system of claim 7 wherein the sensor controller integrated circuit protective material comprises pre-preg.
16. The fingerprint sensing system package of claim 9 wherein the polymer filler comprises epoxy.