IP Library Granted Patent US 8,821,604
Granted Patent B2
US 8,821,604 · App. 13/032,350 · Granted Sep 2, 2014

Polycrystalline diamond compact and method of making same

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Quick Facts
Patent No.
US 8,821,604
App. No.
13/032,350
Granted
Sep 2, 2014
Kind
B2
Abstract

A polycrystalline diamond compact includes a substrate and a polycrystalline diamond table attached to the substrate. The polycrystalline diamond table includes an upper surface and at least one peripheral surface. Diamond grains of the polycrystalline diamond table define a plurality of interstitial regions. The polycrystalline diamond table includes a region having silicon carbide positioned within at least some of the interstitial regions thereof. In an embodiment, the first region extends over only a selected portion of the upper surface and/or at least a portion of the at least one peripheral surface. In another embodiment, the first region substantially contours the upper surface and a chamfer.

Claims (13)

1. A polycrystalline diamond compact, comprising:

a substrate; and

a polycrystalline diamond table attached to the substrate, the polycrystalline diamond table including an upper surface, at least one peripheral surface, and a preformed chamfer extending between the upper surface and the peripheral surface, diamond grains of the polycrystalline diamond table defining a plurality of interstitial regions, the polycrystalline diamond table including:

a first region extending inwardly from the upper surface and the preformed chamfer, the first region substantially contouring the upper surface and the preformed chamfer, the first region extending inwardly a depth measured inwardly from the upper surface that is substantially the same as a depth measured inwardly from and along substantially an entire cross-sectional length of the preformed chamfer, the first region including silicon carbide positioned within at least some of the interstitial regions thereof; and

a bonding region bonded to the substrate, the bonding region including metal-solvent catalyst positioned within a second portion of the interstitial regions.

2. The polycrystalline diamond compact of claim 1 wherein the first region is configured as an annular region that extends peripherally about a portion of the bonding region.

3. The polycrystalline diamond compact of claim 1 wherein the first region is extends along only a selected portion of the upper surface.

4. The polycrystalline diamond compact of claim 1 wherein the first region of the polycrystalline diamond table is substantially free of tungsten carbide.

5. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table comprises tungsten carbide.

6. The polycrystalline diamond compact of claim 1 wherein the diamond grains of the polycrystalline diamond table exhibit an average grain size of about 20 μm or less.

7. The polycrystalline diamond compact of claim 1 wherein the substrate comprises a cemented carbide material.

8. The polycrystalline diamond compact of claim 1 wherein the metal-solvent catalyst comprises cobalt, iron, nickel, or alloys thereof.

9. A rotary drill bit including a bit body adapted to engage a subterranean formation during drilling and at least one superabrasive cutting element affixed to the bit body, wherein the at least one superabrasive cutting element comprises the polycrystalline diamond compact according to claim 1 .

Assignments (6)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2011
From: SANI, MOHAMMAD N.
To: US SYNTHETIC CORPORATION
Reel/Frame 026085/0618 →