IP Library Granted Patent US 8,835,942
Granted Patent B2
US 8,835,942 · App. 13/032,755 · Granted Sep 16, 2014

LED module

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Quick Facts
Patent No.
US 8,835,942
App. No.
13/032,755
Granted
Sep 16, 2014
Kind
B2
Abstract

An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units.

Claims (16)

1. A reconfigurable LED module system, comprising:

a plurality of LED package units each having a submount;

a plurality of first engaging portions and a plurality of first conductive portions disposed on said submount;

at least one LED chip positioned on said submount, said submount of each of said LED package units being a multilayer structure and including a top layer and a bottom layer;

a top surface of said bottom layer being provided with a chip-mounting area for mounting of said LED chip thereon, said top layer being disposed above said bottom layer and having a cavity for exposure of said LED chip which is mounted on said chip-mounting area, said first conductive portions being provided on said top surface of said bottom layer, being spaced apart from each other, surrounding said chip-mounting area, at least two of said first conductive portions being exposed via said cavity for electrical connection with said LED chip, each of said first conductive portions having at least one portion connected to a corresponding one of said first engaging portions; and

at least one connecting unit having a first main body, at least two second engaging portions disposed on said first main body, and at least one second conductive portion having two opposite end sections extending respectively to said second engaging portions;

wherein said second engaging portions engage with corresponding ones of said first engaging portions of two of said LED package units, and said two end sections of said second conductive portion of said connecting unit contact corresponding ones of said first conductive portions of said two LED package units so that said LED package units can be interconnected through said connecting unit and said LED chips of said LED package units can be electrically connected.

2. The reconfigurable LED module system of claim 1 , wherein each of said first engaging portions and a corresponding one of said second engaging portions are configured as interengageable structures that include complementarily shaped groove and protrusion.

3. The reconfigurable LED module system of claim 2 , wherein each of said first engaging portions of each of said LED package units is configured as a protrusion projecting outwardly from a lateral side of said submount, said second engaging portions of said connecting unit being configured as grooves that extend inwardly and respectively from two opposite lateral sides of said first main body, said end sections of said second conductive portion of said connecting unit being exposed through said corresponding grooves, respectively.

4. The reconfigurable LED module system of claim 1 , wherein each of said second engaging portions of said connecting unit has two opposite interior sidewalls formed correspondingly with protrusions to clamp therebetween a corresponding one of said first engaging portions of said LED package unit.

5. The reconfigurable LED module system of claim 1 , wherein each of said first engaging portions is provided with a first retaining structure, and each of said second engaging portions is provided with a second retaining structure, said first retaining structure and said second retaining structure being configured as interengageable structures composed of complementarily shaped stud and hole or complementarily shaped groove and protrusion.

6. The reconfigurable LED module system of claim 1 , wherein said submount of each of said LED package units further includes a heat-dissipating layer provided on a bottom face of said bottom layer.

7. The reconfigurable LED module system of claim 1 , wherein said first main body of said connecting unit has a first end, and a second end opposite to said first end and having a structure similar or complementary to that of said first end.

8. The reconfigurable LED module system of claim 7 , wherein said LED module comprises a plurality of said connecting units, some of said connecting units further comprise at least one third conductive portion disposed on said first main body thereof and two opposite end sections extending respectively to said first and second ends, said third conductive portion being connected electrically to said second conductive portion,

when said first end of one of said connecting units is connected to said second end of another one of said connecting units, said third conductive portions of said connecting units and said first conductive portions of said LED package units are in electrical contact with each other.

9. The reconfigurable LED module system of claim 8 , wherein said first and second ends of some of said connecting units are respectively formed with a plurality of recesses and a plurality of protuberances, each of said recesses being aligned with one of said protuberances along the lengthwise direction of said first main body of a corresponding one of said connecting units, said end sections of any one of said third conductive portions being disposed respectively on one of said recesses and the respective said protuberance.

Assignments (2)
CHANGE OF NAME Recorded May 14, 2013
From: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
To: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
Reel/Frame 030401/0501 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2011
From: CHEN, CHEN-YU; LU, YU-KANG; WANG, YAN-YU
To: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.; LITE-ON TECHNOLOGY CORP.
Reel/Frame 025826/0349 →