IP Library Granted Patent US 8,120,009
Granted Patent B2
US 8,120,009 · App. 13/033,111 · Granted Feb 21, 2012

Nanowhiskers with PN junctions, doped nanowhiskers, and methods for preparing them

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Quick Facts
Patent No.
US 8,120,009
App. No.
13/033,111
Granted
Feb 21, 2012
Kind
B2
Abstract

Nano-engineered structures are disclosed, incorporating nanowhiskers of high mobility conductivity and incorporating pn junctions. In one embodiment, a nanowhisker of a first semiconducting material has a first band gap, and an enclosure comprising at least one second material with a second band gap encloses said nanoelement along at least part of its length, the second material being doped to provide opposite conductivity type charge carriers in respective first and second regions along the length of the of the nanowhisker, whereby to create in the nanowhisker by transfer of charge carriers into the nanowhisker, corresponding first and second regions of opposite conductivity type charge carriers with a region depleted of free carriers therebetween. The doping of the enclosure material may be degenerate so as to create within the nanowhisker adjacent segments having very heavy modulation doping of opposite conductivity type analogous to the heavily doped regions of an Esaki diode. In another embodiment, a nanowhisker is surrounded by polymer material containing dopant material. A step of rapid thermal annealing causes the dopant material to diffuse into the nanowhisker. In a further embodiment, a nanowhisker has a heterojunction between two different intrinsic materials, and Fermi level pinning creates a pn junction at the interface without doping.

Claims (11)

1. A semiconductor device, comprising:

a III-V semiconductor nanowhisker of a first conductivity type standing upright from a substrate; and

a coaxial shell comprising a plurality of III-V semiconductor materials located around at least a portion of the nanowhisker;

wherein:

the coaxial shell has a thickness greater than 200 nm; and

an outer portion of the coaxial shell comprises a III-V semiconductor sheath of a second conductivity type.

2. The device of claim 1 , wherein the first conductivity type comprises n-type and the second conductivity type comprises p-type.

3. The device of claim 1 , wherein the first conductivity type comprises p-type and the second conductivity type comprises n-type.

4. The device of claim 1 , wherein the nanowhisker comprises a one dimensional nanoelement.

5. The device of claim 1 , wherein the substrate comprises a III-V semiconductor substrate.

6. The device of claim 1 , wherein the nanowhisker is formed on the substrate by a VLS process using a gold particle, and the gold particle is located on top of the nanowhisker.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2025
From: QUNANO AB
To: FOLDAL, NILS
Reel/Frame 073259/0214 →
ASSIGNMENT OF IP SECURITY AGREEMENT Recorded Dec 12, 2018
From: GLO AB
To: HERCULES CAPITAL, INC., AS ADMINISTRATIVE AGENT
Reel/Frame 049042/0527 →