CMP PAD DRESSERS WITH HYBRIDIZED CONDITIONING AND RELATED METHODS
The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, for example, a CMP pad conditioner is provided. Such a conditioner can include a support matrix, and a plurality of smooth superabrasive particles disposed in the support matrix, where the smooth superabrasive particles are operable to cut large asperities in a CMP pad. The conditioner also includes a plurality of rough superabrasive particles disposed in the support matrix, where the rough superabrasive particles operable to cut slurry channels on the large asperities, and wherein the slurry channels are cut in such a way as to facilitate slurry movement across the large asperities during a CMP polishing process.
1 . A CMP pad conditioner, comprising:
a support matrix;
a plurality of smooth superabrasive particles disposed in the support matrix, the smooth superabrasive particles operable to cut large asperities in a CMP pad; and
a plurality of rough superabrasive particles disposed in the support matrix, the rough superabrasive particles operable to cut slurry channels on the large asperities, wherein the slurry channels are operable to facilitate slurry movement across the large asperities during a CMP polishing process.
2 . The CMP pad conditioner of claim 1 , wherein cutting tips of the plurality of rough and the plurality of smooth superabrasive particles are substantially leveled to an RA of from about 1 to about 10 microns.
3 . The CMP pad conditioner of claim 1 , wherein the plurality of smooth superabrasive particles are divided into one or more discrete smooth superabrasive particle regions, and wherein the plurality of rough superabrasive particles are divided into one or more discrete rough superabrasive particle regions.
4 . The CMP pad conditioner of claim 4 , wherein the discrete smooth superabrasive particle regions and the discrete rough superabrasive particle regions are arranged in an alternating pattern.
5 . The CMP pad conditioner of claim 1 , wherein the plurality of smooth superabrasive particles and the plurality of rough superabrasive particles are interspersed across the support matrix.
6 . The CMP pad conditioner of claim 1 , wherein the smooth superabrasive particles are single crystal superabrasive particles.
7 . The CMP pad conditioner of claim 6 , wherein the single crystal superabrasive particles are single crystal diamond.
8 . The CMP pad conditioner of claim 1 , wherein the rough superabrasive particles are polycrystalline superabrasive particles.
9 . The CMP pad conditioner of claim 8 , wherein the polycrystalline superabrasive particles are polycrystalline diamond.
10 . The CMP pad conditioner of claim 1 , wherein the rough superabrasive particles are single crystal superabrasive particles having broken tips, edges, faces, or a combination thereof.
11 . The CMP pad conditioner of claim 1 , wherein the smooth superabrasive particles have a configuration sufficient to press at least about 15 microns into a CMP pad before cutting occurs.
12 . The CMP pad conditioner of claim 1 , wherein the rough superabrasive particles have a configuration sufficient to begin cutting when pressed into a CMP pad less than or equal to about 10 microns.
13 . The CMP pad conditioner of claim 1 , wherein the support matrix is a braze metal matrix.
14 . The CMP pad conditioner of claim 1 , wherein the support matrix is an organic matrix.
15 . The CMP pad conditioner of claim 14 , wherein the organic matrix includes a member selected from the group consisting of: amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and combinations thereof.
16 . A method of conditioning a CMP pad, comprising:
cutting large asperities into a CMP pad surface using smooth superabrasive particles; and
cutting slurry channels on the large asperities of the CMP pad surface using rough superabrasive particles, wherein the slurry channels facilitate slurry movement across the large asperities.
17 . The method of claim 16 , wherein the large asperities and the slurry channels are cut simultaneously with the same CMP pad dresser.
18 . The method of claim 16 , wherein the large asperities and the slurry channels are cut sequentially with different CMP pad dressers.
19 . A CMP pad, comprising:
a CMP pad material having a plurality of large asperities cut therein; and
a plurality of slurry channels cut in the plurality of large asperities, the slurry channels being operable to facilitate slurry movement across the large asperities during a CMP polishing process.
20 . The CMP pad of claim 19 , wherein the CMP pad material is a poreless CMP pad material.