IP Library Granted Patent US 8,637,897
Granted Patent B2
US 8,637,897 · App. 13/035,063 · Granted Jan 28, 2014

Semiconductor light emitting device having multi-cell array and method for manufacturing the same

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Quick Facts
Patent No.
US 8,637,897
App. No.
13/035,063
Granted
Jan 28, 2014
Kind
B2
Abstract

A semiconductor light emitting device includes a substrate and a plurality of light emitting cells arranged on the substrate. Each of the light emitting cells includes a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed therebetween to emit blue light. An interconnection structure electrically connects the first-conductivity-type and the second-conductivity-type semiconductor layers of one light emitting cell to the first-conductivity-type and the second-conductivity-type semiconductor layers of another light emitting cell. A light conversion part is formed in a light emitting region defined by the light emitting cells and includes a red and/or a green light conversion part respectively having a red and/or a green light conversion material.

Claims (11)

1. A semiconductor light emitting device comprising:

a plurality of light emitting cells arranged on a conductive substrate, each light emitting cell of the plurality of light emitting cells including a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed between the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer, wherein the second-conductivity-type semiconductor layer of each light emitting cell of the plurality of light emitting cells is electrically connected to the conductive substrate; and

a contiguous interconnection structure disposed on a to surface of the first-conductivity-type semiconductor layer of each light emitting cell and electrically connecting the first-conductivity-type semiconductor layer of one light emitting cell of the plurality of light emitting cells to the first-conductivity-type semiconductor layer of at least one other light emitting cell of the plurality of light emitting cells.

2. The semiconductor light emitting device of claim 1 , further comprising a reflective metal layer disposed between the conductive substrate and the plurality of light emitting cells.

3. The semiconductor light emitting device of claim 1 , wherein the interconnection structure is formed of a metal.

4. The semiconductor light emitting device of claim 1 , wherein a portion of the interconnection structure which is disposed on the top surface of at least the first-conductivity-type semiconductor layer of each light emitting cell is formed of a transparent conductive material.

5. The semiconductor light emitting device of claim 1 , further comprising a barrier layer disposed between the conductive substrate and the plurality of light emitting cells.

6. The semiconductor light emitting device of claim 5 , wherein the barrier layer is electrically connected to the second-conductivity-type semiconductor layer of each of the plurality of light emitting cells.

7. The semiconductor light emitting device of claim 1 , wherein the plurality of light emitting cells are electrically connected in parallel.

8. The semiconductor light emitting device of claim 1 , wherein the interconnection structure is disposed directly on the to surface of the first-conductivity-type semiconductor layer of each light emitting cell.

9. The semiconductor light emitting device of claim 8 , wherein the interconnection structure includes an electrode disposed directly on the to surface of the first-conductivity-type semiconductor layer of each light emitting cell.

Assignments (1)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →